AMD Xilinx
XC6VSX475T-2FF1759I
XC6VSX475T-2FF1759I ECAD Model
XC6VSX475T-2FF1759I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 840 | |
| Number of Outputs | 840 | |
| Number of Logic Cells | 476160 | |
| Combinatorial Delay of a CLB-Max | 4.29 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.286 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1759 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1759 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1759,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 42.50 X 42.50 MM, FBGA-1759 | |
| Pin Count | 1759 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC6VSX475T-2FF1759I Datasheet Download
XC6VSX475T-2FF1759I Overview
The XC6VSX475T-2FF1759I chip model is a powerful model designed for high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language and is suitable for a wide range of applications. This chip model is well-suited for use in networks, and can be used in a variety of intelligent scenarios. It can be used to facilitate the development and popularization of future intelligent robots.
In the era of fully intelligent systems, the XC6VSX475T-2FF1759I chip model can be used to enable a wide range of applications. It can be used to power intelligent robots, autonomous vehicles, and other autonomous systems. It can also be used to facilitate the development of artificial intelligence and machine learning algorithms. It also has the potential to be used in the development of virtual reality and augmented reality applications.
In order to effectively use the XC6VSX475T-2FF1759I chip model, it is necessary to have a good understanding of HDL language and be able to program the chip. Knowledge of the underlying hardware and software architecture is also necessary in order to effectively use the chip. Additionally, knowledge of robotics and artificial intelligence is necessary in order to effectively use the chip to develop and popularize future intelligent robots.
In conclusion, the XC6VSX475T-2FF1759I chip model is a powerful model designed for high-performance digital signal processing, embedded processing, and image processing. It is suitable for use in networks and can be used in a variety of intelligent scenarios. It can also be used to facilitate the development and popularization of future intelligent robots. In order to effectively use the chip, it is necessary to have a good understanding of HDL language, the underlying hardware and software architecture, robotics and artificial intelligence.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||