AMD Xilinx
XC6VSX315T-L1FF1759C
XC6VSX315T-L1FF1759C ECAD Model
XC6VSX315T-L1FF1759C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 720 | |
| Number of Outputs | 720 | |
| Number of Logic Cells | 314880 | |
| Combinatorial Delay of a CLB-Max | 5.87 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1759 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1759 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1759,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Package Description | 42.50 X 42.50 MM, FBGA-1759 | |
| Pin Count | 1759 | |
| ECCN Code | 3A001.A.7.A |
XC6VSX315T-L1FF1759C Datasheet Download
XC6VSX315T-L1FF1759C Overview
The chip model XC6VSX315T-L1FF1759C is a powerful and versatile device, capable of supporting a wide range of applications in various industries. With its high-performance and low-power consumption, it can be used for a variety of tasks, from basic data processing and communications to more complex AI-based tasks. It has been designed to provide high-speed, low-power computing for various applications, including networking, robotics, and machine learning.
The XC6VSX315T-L1FF1759C chip model has numerous advantages, such as its high-performance, low-power consumption, and flexibility. It is also highly reliable and has a wide range of applications. These advantages make it an attractive choice for many industries, and its demand is likely to grow in the future.
The XC6VSX315T-L1FF1759C chip model can be used in networks to provide high-speed and reliable communication. It can also be used in intelligent scenarios, such as speech recognition, image processing, and autonomous navigation. In the era of fully intelligent systems, the chip model can be used to develop and popularize robots that can interact with their environment and make decisions based on their acquired knowledge.
To use the XC6VSX315T-L1FF1759C chip model effectively, technical talents such as engineers and data scientists are needed. Engineers are needed to design and develop the hardware and software components of the chip model, while data scientists are needed to develop algorithms and models that can be used to train the chip model for various tasks. With the help of these professionals, the chip model can be used to develop and popularize future intelligent robots.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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