AMD Xilinx
XC6VSX315T-L1FF1759I
XC6VSX315T-L1FF1759I ECAD Model
XC6VSX315T-L1FF1759I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 720 | |
| Number of Outputs | 720 | |
| Number of Logic Cells | 314880 | |
| Combinatorial Delay of a CLB-Max | 5.87 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1759 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1759 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1759,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | 42.50 X 42.50 MM, FBGA-1759 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 1759 | |
| ECCN Code | 3A001.A.7.A |
XC6VSX315T-L1FF1759I Datasheet Download
XC6VSX315T-L1FF1759I Overview
The Xilinx XC6VSX315T-L1FF1759I chip model is an advanced FPGA (Field Programmable Gate Array) designed to meet the needs of modern communication systems. It is a highly versatile device that can be used in a variety of applications, including high-speed networking, data processing, and real-time signal processing.
The XC6VSX315T-L1FF1759I chip model was designed with the intention of providing a high-performance, low-cost solution for customers who need to deploy advanced communication systems. The device is capable of handling a wide range of data transfer speeds, from low-speed to high-speed communication. It also supports a variety of protocols, such as Ethernet, USB, and PCIe. Furthermore, the device has a wide range of features, including high-speed transceivers, configurable logic blocks, and memory interfaces.
The XC6VSX315T-L1FF1759I chip model is also capable of being upgraded in the future. This is done by replacing the existing components with new ones, or by adding new components to the existing configuration. This makes it possible to keep up with the changing demands of the communication systems and to ensure that they are able to take advantage of the latest technologies.
In addition to its use in communication systems, the XC6VSX315T-L1FF1759I chip model can also be used in the development and popularization of future intelligent robots. This is because the device can be programmed to perform a variety of tasks, such as navigation, object recognition, and decision-making. To take full advantage of the device, it is best to have a team of highly skilled engineers who are familiar with the device and its capabilities.
In order to use the XC6VSX315T-L1FF1759I chip model effectively, it is important to understand the product description and design requirements. It is also important to understand the actual case studies and precautions that must be taken when using the device. Additionally, it is important to have a good understanding of the various protocols and technologies that the device supports.
In conclusion, the Xilinx XC6VSX315T-L1FF1759I chip model is a highly versatile device that can be used in a variety of applications. It is capable of being upgraded in the future, and can be used in the development and popularization of future intelligent robots. In order to use the device effectively, it is important to understand the product description, design requirements, and actual case studies. Additionally, it is important to have a good understanding of the various protocols and technologies that the device supports.
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1,714 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $5,079.8311 | $5,079.8311 |
| 10+ | $5,025.2093 | $50,252.0928 |
| 100+ | $4,752.1001 | $475,210.0080 |
| 1000+ | $4,478.9909 | $2,239,495.4400 |
| 10000+ | $4,096.6380 | $4,096,638.0000 |
| The price is for reference only, please refer to the actual quotation! | ||