AMD Xilinx
XC6VLX760-L1FFG1760I
XC6VLX760-L1FFG1760I ECAD Model
XC6VLX760-L1FFG1760I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 1200 | |
| Number of Outputs | 1200 | |
| Number of Logic Cells | 758784 | |
| Combinatorial Delay of a CLB-Max | 5.87 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1760 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1760 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1760,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 42.50 X 42.50 MM, LEAD FREE, FBGA-1760 | |
| Pin Count | 1760 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XC6VLX760-L1FFG1760I Datasheet Download
XC6VLX760-L1FFG1760I Overview
The chip model XC6VLX760-L1FFG1760I is a state-of-the-art processor designed for advanced applications. It is a powerful device that can be used for a variety of tasks, from communication systems to intelligent robots. The XC6VLX760-L1FFG1760I was designed to meet the needs of modern technology, with features such as a high-performance processor, low power consumption, and a wide range of peripherals.
The XC6VLX760-L1FFG1760I is a versatile chip that can be used in a variety of applications. It can be used in communication systems, such as cellular networks, Wi-Fi, and Bluetooth. It can also be used in the development and popularization of future intelligent robots. As for industry trends, the XC6VLX760-L1FFG1760I is a great choice for businesses that need a reliable and efficient processor.
The XC6VLX760-L1FFG1760I is designed to be future-proof, allowing for easy upgrades and modifications. This makes it a great choice for businesses that need to stay ahead of the curve. As for what specific technologies are needed, the XC6VLX760-L1FFG1760I supports a wide range of technologies, including AI, machine learning, and 5G.
In order to use the XC6VLX760-L1FFG1760I effectively, businesses need to have the right technical talent. This includes engineers and technicians who are familiar with the latest technologies and can develop and maintain the chip. Businesses should also invest in training their personnel to ensure that they are up-to-date with the latest technologies and can use the XC6VLX760-L1FFG1760I to its full potential.
In conclusion, the XC6VLX760-L1FFG1760I is a great choice for businesses that need a reliable and efficient processor. It is designed to be future-proof, allowing for easy upgrades and modifications. It supports a wide range of technologies, making it a great choice for businesses that need to stay ahead of the curve. In order to use the XC6VLX760-L1FFG1760I effectively, businesses need to have the right technical talent. With the right personnel and training, businesses can make the most of the XC6VLX760-L1FFG1760I and stay ahead of the competition.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||