AMD Xilinx
XC6VLX760-L1FFG1760C
XC6VLX760-L1FFG1760C ECAD Model
XC6VLX760-L1FFG1760C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 1200 | |
| Number of Outputs | 1200 | |
| Number of Logic Cells | 758784 | |
| Combinatorial Delay of a CLB-Max | 5.87 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1760 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1760 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1760,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | 42.50 X 42.50 MM, LEAD FREE, FBGA-1760 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 1760 | |
| ECCN Code | 3A001.A.7.A |
XC6VLX760-L1FFG1760C Datasheet Download
XC6VLX760-L1FFG1760C Overview
The XC6VLX760-L1FFG1760C chip model is a high-performance and versatile model that is suitable for a wide range of applications, such as digital signal processing, embedded processing, and image processing. This chip model is designed to be used with the HDL language, which allows for greater control over the design of the chip.
The XC6VLX760-L1FFG1760C chip model has many advantages that make it an attractive option for a variety of applications. It has a high-performance architecture, which makes it suitable for high-performance applications. It also has low power consumption and a small form factor, which makes it ideal for embedded applications. Additionally, the HDL language allows for greater control over the design of the chip, which makes it a great option for customizing the chip model to fit specific needs.
Due to the versatility and performance of the XC6VLX760-L1FFG1760C chip model, there is an increasing demand for this model in various industries. This chip model is being used in a variety of applications, such as automotive, medical, industrial, and consumer electronics. As the demand for these applications continues to grow, the demand for the XC6VLX760-L1FFG1760C chip model is also expected to increase.
When designing a project with the XC6VLX760-L1FFG1760C chip model, there are certain design requirements that must be taken into consideration. These include the power requirements of the chip, the number of pins, the size of the chip, and the type of HDL language used. Additionally, it is important to consider the specific needs of the project, such as the type of application the chip will be used for, the data transmission rate, and the amount of memory needed.
To ensure that the design of the XC6VLX760-L1FFG1760C chip model meets the project's requirements, it is important to consider actual case studies and examples. By looking at how the chip model has been used in other projects, designers can get a better understanding of how the model can be used to meet their specific needs. Additionally, there are certain precautions that should be taken when designing with this chip model, such as ensuring that the chip model is compatible with the HDL language being used and that the necessary power requirements are met.
In conclusion, the XC6VLX760-L1FFG1760C chip model is a versatile and high-performance model that is suitable for a variety of applications. By taking into consideration the design requirements of the project, actual case studies, and precautions, designers can ensure that the chip model meets their specific needs. As the demand for applications that use this chip model continues to grow, the demand for this chip model is expected to increase in the future.
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|---|---|---|
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