AMD Xilinx
XC6VLX760-1FFG1760I
XC6VLX760-1FFG1760I ECAD Model
XC6VLX760-1FFG1760I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 1200 | |
| Number of Outputs | 1200 | |
| Number of Logic Cells | 758784 | |
| Combinatorial Delay of a CLB-Max | 5.08 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1760 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1760 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1760,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 42.50 X 42.50 MM, LEAD FREE, FBGA-1760 | |
| Pin Count | 1760 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XC6VLX760-1FFG1760I Datasheet Download
XC6VLX760-1FFG1760I Overview
The XC6VLX760-1FFG1760I chip model is an advanced integrated circuit designed to meet the needs of modern communication systems. It is a highly integrated, high performance, low power, and low cost solution that offers a wide range of features and capabilities. It is suitable for a variety of applications, including mobile phones, automotive electronics, industrial automation, and consumer electronics.
The XC6VLX760-1FFG1760I chip model offers a number of advantages over other chip models. It is designed with a high level of integration, which allows for a reduction in the number of components required to make a system. This makes the chip model more cost-effective and easier to use. Additionally, it is designed to be highly reliable and resilient, making it suitable for use in a wide range of environments.
The XC6VLX760-1FFG1760I chip model is also designed to be upgradable, allowing for future upgrades to be made without the need for a full replacement. This is beneficial for users who wish to keep their systems up to date without the need for a full system overhaul. Additionally, the chip model is designed to be compatible with a range of communication systems, making it suitable for use in advanced communication systems.
The XC6VLX760-1FFG1760I chip model is designed to meet specific design requirements. It is designed to be highly reliable and resilient, with a high level of integration, low power consumption, and low cost. Additionally, it is designed to be highly compatible with a range of communication systems, making it suitable for use in advanced communication systems.
The XC6VLX760-1FFG1760I chip model has already been used in a number of applications, including automotive electronics, industrial automation, and consumer electronics. Additionally, the chip model has been used in a number of case studies, demonstrating its effectiveness in a variety of situations.
When using the XC6VLX760-1FFG1760I chip model, it is important to consider the specific requirements of the application. Additionally, it is important to ensure that the chip model is suitable for the environment in which it is being used. Furthermore, it is important to take into account any potential upgrades that may be necessary in the future, as well as any compatibility issues that may arise.
The XC6VLX760-1FFG1760I chip model is an advanced integrated circuit designed to meet the needs of modern communication systems. It is a highly integrated, high performance, low power, and low cost solution that offers a wide range of features and capabilities. With its wide range of advantages and its potential for future upgrades, the XC6VLX760-1FFG1760I chip model is expected to become increasingly popular in the coming years in a variety of industries.
You May Also Be Interested In
2,339 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $13,609.6646 | $13,609.6646 |
| 10+ | $13,463.3242 | $134,633.2416 |
| 100+ | $12,731.6218 | $1,273,162.1760 |
| 1000+ | $11,999.9194 | $5,999,959.6800 |
| 10000+ | $10,975.5360 | $10,975,536.0000 |
| The price is for reference only, please refer to the actual quotation! | ||