
AMD Xilinx
XC6VLX760-1FFG1760C
XC6VLX760-1FFG1760C ECAD Model
XC6VLX760-1FFG1760C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 1200 | |
Number of Outputs | 1200 | |
Number of Logic Cells | 758784 | |
Combinatorial Delay of a CLB-Max | 5.08 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 1.098 GHz | |
Power Supplies | 1,1.2/2.5 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B1760 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1760 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1760,42X42,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 42.50 X 42.50 MM, LEAD FREE, FBGA-1760 | |
Pin Count | 1760 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A001.A.7.A | |
HTS Code | 8542.39.00.01 |
XC6VLX760-1FFG1760C Datasheet Download
XC6VLX760-1FFG1760C Overview
The chip model XC6VLX760-1FFG1760C is a new type of FPGA chip designed by Xilinx, Inc. It is a high-speed, low-power FPGA that supports a wide range of applications, including communication systems, networks, and intelligent systems.
The original design intention of XC6VLX760-1FFG1760C is to provide the most advanced FPGA technology to meet the needs of modern applications. It is designed to offer high performance and low power consumption, making it an ideal choice for a variety of applications. It supports a wide range of data rates, making it suitable for high-speed communication and processing tasks. The FPGA also supports a variety of interfaces, including USB, Ethernet, and PCI Express, making it suitable for a wide range of applications.
The possibility of future upgrades for XC6VLX760-1FFG1760C is also very high. The FPGA is designed to be easily upgradable, and the company has released a variety of software and hardware updates that can be used to improve the performance and features of the FPGA. Additionally, the FPGA is designed to be able to support a wide range of intelligent scenarios, making it ideal for use in the era of fully intelligent systems.
The product description of XC6VLX760-1FFG1760C includes its features and specifications, as well as its design requirements. The FPGA features a wide range of I/O interfaces, including USB, Ethernet, and PCI Express, as well as a wide range of data rates. It also supports a variety of programming languages, including VHDL and Verilog, and it is designed to be easily upgradable.
In terms of actual case studies and precautions, XC6VLX760-1FFG1760C has been successfully used in a variety of applications, including communication systems, networks, and intelligent systems. However, it is important to ensure that the FPGA is properly configured and programmed in order to ensure optimal performance. Additionally, it is important to ensure that all necessary software and hardware updates are installed, as these can help improve the performance and features of the FPGA.
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1,901 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $6,866.1553 | $6,866.1553 |
10+ | $6,792.3257 | $67,923.2568 |
100+ | $6,423.1775 | $642,317.7549 |
1000+ | $6,054.0294 | $3,027,014.7070 |
10000+ | $5,537.2220 | $5,537,222.0250 |
The price is for reference only, please refer to the actual quotation! |