AMD Xilinx
XC6VLX550T-L1FFG1760C
XC6VLX550T-L1FFG1760C ECAD Model
XC6VLX550T-L1FFG1760C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 1200 | |
| Number of Outputs | 1200 | |
| Number of Logic Cells | 549888 | |
| Combinatorial Delay of a CLB-Max | 5.87 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1760 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1760 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1760,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | 42.50 X 42.50 MM, LEAD FREE, FBGA-1760 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 1760 | |
| ECCN Code | 3A001.A.7.A |
XC6VLX550T-L1FFG1760C Datasheet Download
XC6VLX550T-L1FFG1760C Overview
The XC6VLX550T-L1FFG1760C chip model is a powerful device that is expected to become increasingly popular in the coming years due to its many advantages. This chip model is capable of providing high-performance computing capabilities, allowing it to be used in a variety of applications. It is also designed to be low power and cost-effective, making it a great choice for many industries.
In terms of network applications, the XC6VLX550T-L1FFG1760C chip model is ideal for use in intelligent scenarios. It is capable of providing the necessary computing power for applications such as facial recognition, natural language processing, and image recognition, making it a great choice for a wide range of intelligent systems. It is also capable of providing the necessary computing power for the development of autonomous vehicles, making it a great choice for the era of fully intelligent systems.
The XC6VLX550T-L1FFG1760C chip model is designed to be highly reliable and efficient. It is designed to be able to handle high-performance tasks without compromising on power consumption or cost. It is also designed with a number of safety features, making it a great choice for applications where safety is paramount.
When designing applications that use the XC6VLX550T-L1FFG1760C chip model, it is important to consider the specific design requirements of the chip. This includes ensuring that the application is designed to take full advantage of the chip’s features, as well as ensuring that the application is designed to be reliable and efficient. It is also important to consider the safety features of the chip, as well as any potential risks associated with the application.
In addition to considering the design requirements of the chip, it is also important to consider actual case studies and precautions when using the XC6VLX550T-L1FFG1760C chip model. Case studies can provide valuable insight into the performance of the chip in various applications, as well as any potential risks associated with the chip. Additionally, it is important to consider the safety features of the chip, as well as any potential risks associated with the application.
Overall, the XC6VLX550T-L1FFG1760C chip model is an excellent choice for many industries due to its many advantages. It is capable of providing high-performance computing capabilities, making it a great choice for applications such as facial recognition, natural language processing, and image recognition. It is also designed to be low power and cost-effective, making it a great choice for many industries. When designing applications that use the XC6VLX550T-L1FFG1760C chip model, it is important to consider the specific design requirements of the chip, as well as any potential risks associated with the application. Additionally, it is important to consider actual case studies and precautions when using the chip.
You May Also Be Interested In
3,027 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||