AMD Xilinx
XC6VLX550T-L1FF1759I
XC6VLX550T-L1FF1759I ECAD Model
XC6VLX550T-L1FF1759I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 840 | |
| Number of Outputs | 840 | |
| Number of Logic Cells | 549888 | |
| Combinatorial Delay of a CLB-Max | 5.87 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1759 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1759 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1759,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 42.50 X 42.50 MM, FBGA-1759 | |
| Pin Count | 1759 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XC6VLX550T-L1FF1759I Datasheet Download
XC6VLX550T-L1FF1759I Overview
The chip model XC6VLX550T-L1FF1759I is an FPGA chip with advanced features and capabilities. It is designed to provide reliable operation and performance for a variety of applications. The chip model is equipped with a wide range of features, including high-speed transceivers, high-performance logic, and embedded memory. It also offers a variety of I/O and power options, allowing users to customize the chip for their specific needs.
The chip model has already become popular in the industry and is expected to remain a top choice for many applications in the future. It is a powerful tool for creating and deploying high-performance systems and applications. It can be used to develop complex systems with multiple components and features, as well as to create powerful embedded systems and applications.
The chip model is also expected to be used in the development of intelligent robots. It is a powerful tool for creating robots that can process data and respond to their environment. The chip model is capable of providing the necessary processing power and features to enable robots to interact with their environment, as well as to make decisions and take actions.
In order to use the chip model effectively, it is important to have the right technical talent. This includes engineers and technicians who have experience with FPGAs and embedded systems. They should also have experience with programming and designing systems with the chip model. Having the right technical talent is essential for creating and deploying powerful and reliable systems and applications with the chip model.
Overall, the chip model XC6VLX550T-L1FF1759I is a powerful and reliable tool for creating and deploying high-performance systems and applications. It is expected to remain popular in the industry and to be used in the development of intelligent robots in the future. In order to use the chip model effectively, it is important to have the right technical talent. With the right technical talent and the right chip model, it is possible to create powerful, reliable, and efficient systems and applications.
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|---|---|---|
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