AMD Xilinx
XC6VLX550T-2FFG1760I
XC6VLX550T-2FFG1760I ECAD Model
XC6VLX550T-2FFG1760I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1 V | |
| Number of Inputs | 1200 | |
| Number of Outputs | 1200 | |
| Number of Logic Cells | 549888 | |
| Combinatorial Delay of a CLB-Max | 4.29 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | INDUSTRIAL | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.286 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 1.05 V | |
| Supply Voltage-Min | 950 mV | |
| JESD-30 Code | S-PBGA-B1760 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1760 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1760,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 42.50 X 42.50 MM, LEAD FREE, FBGA-1760 | |
| Pin Count | 1760 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC6VLX550T-2FFG1760I Datasheet Download
XC6VLX550T-2FFG1760I Overview
The XC6VLX550T-2FFG1760I chip model is a powerful and advanced tool that can be used in various industries. It is manufactured by Xilinx, a leading provider of programmable logic solutions. The chip model is designed to be used in a wide range of applications, from industrial automation to consumer electronics. It is also suitable for use in high-performance computing, communication systems, and other specialized applications.
The XC6VLX550T-2FFG1760I chip model is based on the Virtex-6 family of FPGAs. It is designed to provide high-performance and low-power solutions for a variety of applications. It is also equipped with a large number of high-speed transceivers, making it suitable for use in high-speed communication systems. The chip model also supports advanced features such as partial reconfiguration, which makes it ideal for use in advanced communication systems.
The XC6VLX550T-2FFG1760I chip model is designed to be used in a wide range of applications. It can be used in networks, as well as in intelligent scenarios such as robotics and artificial intelligence. It is also suitable for use in the era of fully intelligent systems. It is also capable of being upgraded in the future to support new technologies and applications.
The XC6VLX550T-2FFG1760I chip model is a powerful and flexible tool that can be used in a wide range of applications. It is designed to provide high-performance and low-power solutions for a variety of applications. It is also capable of being upgraded in the future to support new technologies and applications. It is also suitable for use in networks, as well as in intelligent scenarios such as robotics and artificial intelligence. It is also suitable for use in the era of fully intelligent systems, making it an ideal choice for those looking to develop advanced communication systems.
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