XC6VLX550T-2FF1759I
XC6VLX550T-2FF1759I
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rohs

AMD Xilinx

XC6VLX550T-2FF1759I


XC6VLX550T-2FF1759I
F20-XC6VLX550T-2FF1759I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 42.50 X 42.50 MM, FBGA-1759
42.50 X 42.50 MM, FBGA-1759

XC6VLX550T-2FF1759I ECAD Model


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XC6VLX550T-2FF1759I Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1 V
Number of Inputs 840
Number of Outputs 840
Number of Logic Cells 549888
Combinatorial Delay of a CLB-Max 4.29 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade INDUSTRIAL
Package Shape SQUARE
Technology CMOS
Clock Frequency-Max 1.286 GHz
Power Supplies 1,1.2/2.5 V
Supply Voltage-Max 1.05 V
Supply Voltage-Min 950 mV
JESD-30 Code S-PBGA-B1759
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1759
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1759,42X42,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 42.50 X 42.50 MM, FBGA-1759
Pin Count 1759
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC6VLX550T-2FF1759I Datasheet Download


XC6VLX550T-2FF1759I Overview



The XC6VLX550T-2FF1759I chip model is a powerful and versatile tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to be compatible with the HDL language, making it an ideal choice for a wide range of applications.


The XC6VLX550T-2FF1759I chip model offers several advantages that make it highly desirable for use in various industries. It is designed to be energy-efficient and offers high-speed performance with low power consumption. It also offers a wide range of features and functions, making it suitable for a variety of tasks. Additionally, it is designed to be highly reliable and durable, making it a great choice for long-term use.


As the demand for high-performance processing increases, the XC6VLX550T-2FF1759I chip model is expected to remain in high demand in the future. It is likely to be used in a variety of industries, including automotive, healthcare, and industrial applications. The chip model is also likely to be used in a variety of emerging technologies, such as artificial intelligence and machine learning.


The XC6VLX550T-2FF1759I chip model is a great choice for users looking for a reliable and powerful processor. Its energy efficiency, high-speed performance, and wide range of features make it an ideal choice for a variety of applications. As the demand for high-performance processing continues to grow, the XC6VLX550T-2FF1759I chip model is expected to remain in high demand in the future.



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