
AMD Xilinx
XC6VLX550T-2FF1759I
XC6VLX550T-2FF1759I ECAD Model
XC6VLX550T-2FF1759I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1 V | |
Number of Inputs | 840 | |
Number of Outputs | 840 | |
Number of Logic Cells | 549888 | |
Combinatorial Delay of a CLB-Max | 4.29 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | INDUSTRIAL | |
Package Shape | SQUARE | |
Technology | CMOS | |
Clock Frequency-Max | 1.286 GHz | |
Power Supplies | 1,1.2/2.5 V | |
Supply Voltage-Max | 1.05 V | |
Supply Voltage-Min | 950 mV | |
JESD-30 Code | S-PBGA-B1759 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 100 °C | |
Operating Temperature-Min | -40 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1759 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1759,42X42,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 42.50 X 42.50 MM, FBGA-1759 | |
Pin Count | 1759 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC6VLX550T-2FF1759I Datasheet Download
XC6VLX550T-2FF1759I Overview
The XC6VLX550T-2FF1759I chip model is a powerful and versatile tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to be compatible with the HDL language, making it an ideal choice for a wide range of applications.
The XC6VLX550T-2FF1759I chip model offers several advantages that make it highly desirable for use in various industries. It is designed to be energy-efficient and offers high-speed performance with low power consumption. It also offers a wide range of features and functions, making it suitable for a variety of tasks. Additionally, it is designed to be highly reliable and durable, making it a great choice for long-term use.
As the demand for high-performance processing increases, the XC6VLX550T-2FF1759I chip model is expected to remain in high demand in the future. It is likely to be used in a variety of industries, including automotive, healthcare, and industrial applications. The chip model is also likely to be used in a variety of emerging technologies, such as artificial intelligence and machine learning.
The XC6VLX550T-2FF1759I chip model is a great choice for users looking for a reliable and powerful processor. Its energy efficiency, high-speed performance, and wide range of features make it an ideal choice for a variety of applications. As the demand for high-performance processing continues to grow, the XC6VLX550T-2FF1759I chip model is expected to remain in high demand in the future.
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