AMD Xilinx
XC6VLX365T-L1FF1759C
XC6VLX365T-L1FF1759C ECAD Model
XC6VLX365T-L1FF1759C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 720 | |
| Number of Outputs | 720 | |
| Number of Logic Cells | 364032 | |
| Combinatorial Delay of a CLB-Max | 5.87 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1759 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1759 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1759,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 42.50 X 42.50 MM, FBGA-1759 | |
| Pin Count | 1759 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XC6VLX365T-L1FF1759C Datasheet Download
XC6VLX365T-L1FF1759C Overview
The XC6VLX365T-L1FF1759C chip model is a powerful and versatile tool for digital signal processing, embedded processing, and image processing. It is designed to be used with HDL language, a hardware description language that allows for the development of complex digital systems. With its ability to handle large data sets and perform complex calculations quickly, the XC6VLX365T-L1FF1759C chip model is becoming increasingly popular in many industries.
The XC6VLX365T-L1FF1759C chip model offers several advantages over traditional processors. It is capable of handling large data sets quickly and accurately. It also has a high level of parallelism, meaning that it can process multiple tasks simultaneously. This makes it ideal for applications such as image processing, where the chip can process multiple images simultaneously. Additionally, the XC6VLX365T-L1FF1759C chip model is energy efficient, making it an attractive option for many applications.
The XC6VLX365T-L1FF1759C chip model is expected to continue to grow in popularity in many industries, as it is well-suited to handle many of the tasks that are commonly required. For example, in the medical field, the chip can be used to process large amounts of data quickly and accurately. In the automotive industry, the chip can be used to process images quickly and accurately, making it an ideal tool for autonomous vehicles.
The XC6VLX365T-L1FF1759C chip model can also be used in the development and popularization of future intelligent robots. The chip has the ability to process large amounts of data quickly and accurately, making it an ideal tool for robots that are able to learn and adapt to their environment. To use the XC6VLX365T-L1FF1759C chip model effectively, engineers and developers will need to have a good understanding of HDL language and be familiar with the chip's capabilities. Additionally, they will need to have a good understanding of robotics and artificial intelligence, as these are key components in the development of intelligent robots.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||