AMD Xilinx
XC6VLX240T-L1FF1759C
XC6VLX240T-L1FF1759C ECAD Model
XC6VLX240T-L1FF1759C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 900 mV | |
| Number of Inputs | 720 | |
| Number of Outputs | 720 | |
| Number of Logic Cells | 241152 | |
| Combinatorial Delay of a CLB-Max | 5.87 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Clock Frequency-Max | 1.098 GHz | |
| Power Supplies | 1,1.2/2.5 V | |
| Supply Voltage-Max | 930 mV | |
| Supply Voltage-Min | 870 mV | |
| JESD-30 Code | S-PBGA-B1759 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1759 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1759,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.5 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 42.50 X 42.50 MM, FBGA-1759 | |
| Pin Count | 1759 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | 3A001.A.7.A | |
| HTS Code | 8542.39.00.01 |
XC6VLX240T-L1FF1759C Datasheet Download
XC6VLX240T-L1FF1759C Overview
The XC6VLX240T-L1FF1759C chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language, which is a type of programming language used to describe the behavior of digital systems. This chip model is designed to provide users with a high degree of flexibility and scalability, allowing them to customize their applications to meet their specific requirements.
The XC6VLX240T-L1FF1759C chip model can be applied to a wide range of scenarios, including networking, intelligent systems, and more. It is capable of handling complex tasks such as data transmission, storage, and analysis, making it a great choice for applications that require high levels of performance. Additionally, its scalability allows it to be used in the era of fully intelligent systems, as it can be easily adapted to meet the needs of the system.
The product description of the XC6VLX240T-L1FF1759C chip model includes a number of features that make it an ideal choice for a variety of applications. It is designed to provide users with a high degree of flexibility, allowing them to customize their applications to meet their specific needs. Additionally, it is capable of handling complex tasks such as data transmission, storage, and analysis, making it a great choice for applications that require high levels of performance.
When it comes to designing with the XC6VLX240T-L1FF1759C chip model, there are a few key considerations that should be taken into account. First and foremost, it is important to ensure that the design meets the specific requirements of the application. Additionally, it is important to ensure that the design is optimized for the chip model, as this will ensure that it runs as efficiently as possible. Finally, it is important to consider any safety and security considerations when designing with the chip model.
Case studies of the XC6VLX240T-L1FF1759C chip model can be found in various publications and online resources. These case studies provide a great insight into how the chip model can be used in various applications and scenarios. Additionally, these case studies can provide valuable information on the best practices for designing with the chip model, as well as any potential pitfalls that may arise.
In conclusion, the XC6VLX240T-L1FF1759C chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It is capable of handling complex tasks such as data transmission, storage, and analysis, making it a great choice for applications that require high levels of performance. Additionally, it is designed to provide users with a high degree of flexibility and scalability, allowing them to customize their applications to meet their specific requirements. When designing with the chip model, it is important to consider the product description, design requirements, and case studies to ensure that the design meets the specific needs of the application.
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