AMD Xilinx
XC5210-6PG223I
XC5210-6PG223I ECAD Model
XC5210-6PG223I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 196 | |
| Number of Outputs | 196 | |
| Number of Logic Cells | 324 | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 324 | |
| Combinatorial Delay of a CLB-Max | 5.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 324 CLBS, 10000 GATES | |
| Additional Feature | MAX AVAILABLE 16000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-CPGA-P223 | |
| Qualification Status | Not Qualified | |
| Moisture Sensitivity Level | 1 | |
| Number of Terminals | 223 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | HPGA | |
| Package Equivalence Code | PGA223,18X18 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 47.244 mm | |
| Length | 47.244 mm | |
| Seated Height-Max | 4.318 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | HPGA, PGA223,18X18 | |
| Pin Count | 223 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC5210-6PG223I Datasheet Download
XC5210-6PG223I Overview
The XC5210-6PG223I chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to be used with HDL (Hardware Description Language) for programming and development. This chip model is a great choice for applications that require high-performance computing and fast data processing.
The XC5210-6PG223I chip model is capable of performing complex tasks quickly and efficiently. It offers a wide range of features and functions that make it suitable for a variety of applications. It has a high clock speed, low power consumption, and a small footprint. Additionally, it is highly reliable and durable, making it ideal for long-term use.
In terms of industry trends, the XC5210-6PG223I chip model is expected to remain popular in the future. It is a versatile and powerful tool that can be used in a variety of applications. As technology advances, the chip model will continue to be used in new and innovative ways. It is likely that new technologies will be needed to support the chip model in order to keep up with the ever-changing demands of the industry.
The XC5210-6PG223I chip model has a number of advantages that make it an attractive choice for many businesses. It is cost-effective, reliable, and energy-efficient. Additionally, it is compatible with a wide range of software and hardware, making it a great choice for businesses that require flexibility. Furthermore, it is easy to use and program, making it ideal for businesses with limited technical expertise.
The XC5210-6PG223I chip model is expected to remain in high demand in the future. It is a powerful and versatile tool that can be used in a variety of applications. It is a cost-effective, reliable, and energy-efficient solution that is compatible with a wide range of software and hardware. As technology advances, the chip model will continue to be used in new and innovative ways, making it a great choice for businesses that require high-performance computing and fast data processing.
You May Also Be Interested In
3,990 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||