XC5210-6PG223C
XC5210-6PG223C
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rohs

AMD Xilinx

XC5210-6PG223C


XC5210-6PG223C
F20-XC5210-6PG223C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, HPGA, PGA223,18X18
HPGA, PGA223,18X18

XC5210-6PG223C ECAD Model


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XC5210-6PG223C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Supply Voltage-Nom 5 V
Number of Inputs 196
Number of Outputs 196
Number of Logic Cells 324
Number of Equivalent Gates 10000
Number of CLBs 324
Combinatorial Delay of a CLB-Max 5.6 ns
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 324 CLBS, 10000 GATES
Additional Feature MAX AVAILABLE 16000 LOGIC GATES
Clock Frequency-Max 83 MHz
Power Supplies 5 V
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
JESD-30 Code S-CPGA-P223
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 1
Operating Temperature-Max 85 °C
Number of Terminals 223
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code HPGA
Package Equivalence Code PGA223,18X18
Package Shape SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG
Surface Mount NO
Terminal Finish TIN LEAD
Terminal Form PIN/PEG
Terminal Pitch 2.54 mm
Terminal Position PERPENDICULAR
Width 47.244 mm
Length 47.244 mm
Seated Height-Max 4.318 mm
Ihs Manufacturer XILINX INC
Part Package Code PGA
Package Description HPGA, PGA223,18X18
Pin Count 223
Reach Compliance Code unknown
HTS Code 8542.39.00.01

XC5210-6PG223C Datasheet Download


XC5210-6PG223C Overview



The XC5210-6PG223C chip model is a high-performance integrated circuit designed for digital signal processing, embedded processing, and image processing. It is an ideal choice for those looking to build complex systems that require a high level of precision and performance. The XC5210-6PG223C chip model is programmed using the HDL (Hardware Description Language) language, making it a powerful tool for creating sophisticated systems.


The XC5210-6PG223C chip model offers a number of advantages over traditional digital signal processing and embedded processing chips. It is capable of handling complex data processing tasks with a high degree of accuracy and speed. Additionally, the XC5210-6PG223C chip model is capable of being upgraded in the future, allowing it to stay up to date with the latest technology.


The XC5210-6PG223C chip model is expected to be in high demand in the near future due to its impressive performance and scalability. As more businesses and organizations look to build complex systems, the XC5210-6PG223C chip model will be an ideal choice for them, as it can handle a wide range of tasks with ease. Additionally, the XC5210-6PG223C chip model is capable of being used in advanced communication systems, making it a great choice for those looking to build sophisticated networks.


The original design intention of the XC5210-6PG223C chip model was to create a powerful integrated circuit that could handle complex tasks with a high degree of accuracy and speed. The chip model was designed to be scalable, allowing it to stay up to date with the latest technology. Additionally, the chip model was designed with the possibility of future upgrades in mind, ensuring that it could remain a viable option for those looking to build complex systems.


In conclusion, the XC5210-6PG223C chip model is a powerful integrated circuit designed for digital signal processing, embedded processing, and image processing. It is programmed using the HDL language, making it a powerful tool for creating sophisticated systems. The chip model offers a number of advantages over traditional digital signal processing and embedded processing chips, and is expected to be in high demand in the near future due to its impressive performance and scalability. Additionally, the chip model was designed with the possibility of future upgrades in mind, ensuring that it could remain a viable option for those looking to build complex systems.



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