
AMD Xilinx
XC5210-6PG223C
XC5210-6PG223C ECAD Model
XC5210-6PG223C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 5 V | |
Number of Inputs | 196 | |
Number of Outputs | 196 | |
Number of Logic Cells | 324 | |
Number of Equivalent Gates | 10000 | |
Number of CLBs | 324 | |
Combinatorial Delay of a CLB-Max | 5.6 ns | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 324 CLBS, 10000 GATES | |
Additional Feature | MAX AVAILABLE 16000 LOGIC GATES | |
Clock Frequency-Max | 83 MHz | |
Power Supplies | 5 V | |
Supply Voltage-Max | 5.25 V | |
Supply Voltage-Min | 4.75 V | |
JESD-30 Code | S-CPGA-P223 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 1 | |
Operating Temperature-Max | 85 °C | |
Number of Terminals | 223 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | HPGA | |
Package Equivalence Code | PGA223,18X18 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, HEAT SINK/SLUG | |
Surface Mount | NO | |
Terminal Finish | TIN LEAD | |
Terminal Form | PIN/PEG | |
Terminal Pitch | 2.54 mm | |
Terminal Position | PERPENDICULAR | |
Width | 47.244 mm | |
Length | 47.244 mm | |
Seated Height-Max | 4.318 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | PGA | |
Package Description | HPGA, PGA223,18X18 | |
Pin Count | 223 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 |
XC5210-6PG223C Datasheet Download
XC5210-6PG223C Overview
The XC5210-6PG223C chip model is a high-performance integrated circuit designed for digital signal processing, embedded processing, and image processing. It is an ideal choice for those looking to build complex systems that require a high level of precision and performance. The XC5210-6PG223C chip model is programmed using the HDL (Hardware Description Language) language, making it a powerful tool for creating sophisticated systems.
The XC5210-6PG223C chip model offers a number of advantages over traditional digital signal processing and embedded processing chips. It is capable of handling complex data processing tasks with a high degree of accuracy and speed. Additionally, the XC5210-6PG223C chip model is capable of being upgraded in the future, allowing it to stay up to date with the latest technology.
The XC5210-6PG223C chip model is expected to be in high demand in the near future due to its impressive performance and scalability. As more businesses and organizations look to build complex systems, the XC5210-6PG223C chip model will be an ideal choice for them, as it can handle a wide range of tasks with ease. Additionally, the XC5210-6PG223C chip model is capable of being used in advanced communication systems, making it a great choice for those looking to build sophisticated networks.
The original design intention of the XC5210-6PG223C chip model was to create a powerful integrated circuit that could handle complex tasks with a high degree of accuracy and speed. The chip model was designed to be scalable, allowing it to stay up to date with the latest technology. Additionally, the chip model was designed with the possibility of future upgrades in mind, ensuring that it could remain a viable option for those looking to build complex systems.
In conclusion, the XC5210-6PG223C chip model is a powerful integrated circuit designed for digital signal processing, embedded processing, and image processing. It is programmed using the HDL language, making it a powerful tool for creating sophisticated systems. The chip model offers a number of advantages over traditional digital signal processing and embedded processing chips, and is expected to be in high demand in the near future due to its impressive performance and scalability. Additionally, the chip model was designed with the possibility of future upgrades in mind, ensuring that it could remain a viable option for those looking to build complex systems.
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