AMD Xilinx
XC5210-5PG223C
XC5210-5PG223C ECAD Model
XC5210-5PG223C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 196 | |
| Number of Outputs | 196 | |
| Number of Logic Cells | 324 | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 324 | |
| Combinatorial Delay of a CLB-Max | 4.6 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 324 CLBS, 10000 GATES | |
| Additional Feature | MAX AVAILABLE 16000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-CPGA-P223 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 223 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | HPGA | |
| Package Equivalence Code | PGA223,18X18 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | NO | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 47.244 mm | |
| Length | 47.244 mm | |
| Seated Height-Max | 4.318 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | HPGA, PGA223,18X18 | |
| Pin Count | 223 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC5210-5PG223C Datasheet Download
XC5210-5PG223C Overview
The XC5210-5PG223C chip model is a powerful tool for high-performance digital signal processing, embedded processing, and image processing. It is designed to enable users to quickly and efficiently implement complex algorithms and processes in their applications. The chip model features a high-speed, low-power architecture and is compatible with HDL languages, allowing for easy integration into existing systems.
The XC5210-5PG223C chip model offers several advantages over other chip models, including its high-speed performance, low-power consumption, and compatibility with HDL languages. This makes the chip model an ideal choice for applications that require high-performance digital signal processing, embedded processing, and image processing. Additionally, the chip model is highly scalable, meaning that it can be used for a variety of applications and can be easily upgraded as needed.
In the future, the XC5210-5PG223C chip model is expected to see increased demand in the embedded systems, robotics, and machine learning industries. As more companies and organizations move towards the development and popularization of intelligent robots, the chip model will be essential for providing the necessary processing power. The chip model’s compatibility with HDL languages makes it an ideal choice for these applications, as it can be easily integrated into existing systems.
The XC5210-5PG223C chip model can be effectively used in the development and popularization of future intelligent robots. However, in order to use the model effectively, certain technical talents are required. This includes knowledge of HDL languages, as well as an understanding of digital signal processing, embedded processing, and image processing. Additionally, experience in robotics and machine learning will be beneficial for those looking to use the chip model for these applications. With the right technical talents, the XC5210-5PG223C chip model can be used to create powerful and efficient intelligent robots.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||