AMD Xilinx
XC5210-3PG223C
XC5210-3PG223C ECAD Model
XC5210-3PG223C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 196 | |
| Number of Outputs | 196 | |
| Number of Logic Cells | 324 | |
| Number of Equivalent Gates | 10000 | |
| Number of CLBs | 324 | |
| Combinatorial Delay of a CLB-Max | 3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 324 CLBS, 10000 GATES | |
| Additional Feature | MAX AVAILABLE 16000 LOGIC GATES | |
| Clock Frequency-Max | 83 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-CPGA-P223 | |
| Qualification Status | Not Qualified | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 223 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | HPGA | |
| Package Equivalence Code | PGA223,18X18 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 47.244 mm | |
| Length | 47.244 mm | |
| Seated Height-Max | 4.318 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | HPGA, PGA223,18X18 | |
| Pin Count | 223 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC5210-3PG223C Datasheet Download
XC5210-3PG223C Overview
The XC5210-3PG223C chip model is a high-performance, embedded processor designed for digital signal processing, image processing, and other applications. It is designed to be used with the HDL (Hardware Description Language) language, making it an ideal choice for those who need a powerful processor that can handle complex tasks.
The XC5210-3PG223C chip model offers a number of advantages over other processors. It is able to handle complex tasks quickly and efficiently, and its design allows for a high degree of customization. It also has a low power consumption, making it suitable for use in a variety of applications. Additionally, the XC5210-3PG223C chip model supports multiple core architectures, allowing it to be used in a wide range of applications.
The demand for the XC5210-3PG223C chip model is expected to increase in the future, as more applications and projects require the use of this type of processor. For example, the chip model is used in a variety of applications such as medical imaging, gaming, and robotics. Additionally, the chip model is also used in industrial applications, such as factory automation and machine vision.
The design of the XC5210-3PG223C chip model is highly customizable, allowing for the creation of custom applications and projects. For example, the chip model can be used to create a wide range of digital signal processing applications, including digital filters, signal processing algorithms, and more. Additionally, the chip model can be used to create embedded systems, such as robotics and machine vision systems.
When designing a project with the XC5210-3PG223C chip model, it is important to consider the specific requirements of the project. This includes the power consumption, the number of cores, and the type of HDL language that will be used. Additionally, it is important to consider the specific requirements of the project when designing the application. For example, it is important to consider the specific algorithms that will be used and the type of memory that will be used.
Finally, when using the XC5210-3PG223C chip model, it is important to consider the potential risks associated with using the chip model. For example, it is important to consider the potential for errors and malfunctions when using the chip model. Additionally, it is important to consider the potential for data loss when using the chip model. By taking these precautions into account, it is possible to ensure that the project is designed and implemented correctly.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||