
AMD Xilinx
XC4VSX25-12FFG668C
XC4VSX25-12FFG668C ECAD Model
XC4VSX25-12FFG668C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 320 | |
Number of Outputs | 320 | |
Number of Logic Cells | 23040 | |
Number of CLBs | 2560 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 2560 CLBS | |
Clock Frequency-Max | 1.205 GHz | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B668 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 668 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA668,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.85 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | LEAD FREE, FBGA-668 | |
Pin Count | 668 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC4VSX25-12FFG668C Datasheet Download
XC4VSX25-12FFG668C Overview
The Xilinx XC4VSX25-12FFG668C chip is a field-programmable gate array (FPGA) device that is designed to meet the needs of a wide range of applications. It is suitable for various types of digital systems, ranging from simple logic to complex signal processing. The chip is made up of a large number of programmable logic elements and memory blocks, giving it the flexibility to be tailored to fit the specific requirements of any project.
The original design intention of the XC4VSX25-12FFG668C chip was to provide a reliable, cost-effective solution for digital signal processing and other digital systems. It is equipped with a wide range of features that make it suitable for a variety of applications, such as high-speed serial communication, video processing, and digital signal processing. It also has the capability to be upgraded to meet the needs of more advanced systems.
The XC4VSX25-12FFG668C chip can be used for a variety of digital systems, including communication systems. It has a number of features that make it suitable for use in advanced communication systems, such as its high-speed serial communication capability, its ability to support multiple data rates, and its ability to handle large amounts of data. However, it is important to note that the chip has certain limitations which must be taken into account when designing a communication system. For example, it is not suitable for use in systems that require high levels of security or encryption.
The XC4VSX25-12FFG668C chip can also be used in the development and popularization of future intelligent robots. The chip is equipped with a powerful processor, allowing it to be used for complex tasks such as artificial intelligence and machine learning. However, it is important to note that the chip requires a high level of technical expertise in order to be used effectively. In addition, it is important to ensure that the chip is properly configured and programmed, as it can be difficult to debug and troubleshoot.
In conclusion, the XC4VSX25-12FFG668C chip is a powerful and versatile FPGA device that can be used for a variety of digital systems, including advanced communication systems and future intelligent robots. It has the flexibility to be tailored to meet the specific requirements of any project, and it can be upgraded to meet the needs of more advanced systems. However, it is important to note that the chip requires a high level of technical expertise in order to be used effectively.
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