XC4VSX25-12FFG668C
XC4VSX25-12FFG668C
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rohs

AMD Xilinx

XC4VSX25-12FFG668C


XC4VSX25-12FFG668C
F20-XC4VSX25-12FFG668C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LEAD FREE, FBGA-668
LEAD FREE, FBGA-668

XC4VSX25-12FFG668C ECAD Model


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XC4VSX25-12FFG668C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Inputs 320
Number of Outputs 320
Number of Logic Cells 23040
Number of CLBs 2560
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 2560 CLBS
Clock Frequency-Max 1.205 GHz
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B668
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 668
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA668,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.85 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LEAD FREE, FBGA-668
Pin Count 668
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC4VSX25-12FFG668C Datasheet Download


XC4VSX25-12FFG668C Overview



The Xilinx XC4VSX25-12FFG668C chip is a field-programmable gate array (FPGA) device that is designed to meet the needs of a wide range of applications. It is suitable for various types of digital systems, ranging from simple logic to complex signal processing. The chip is made up of a large number of programmable logic elements and memory blocks, giving it the flexibility to be tailored to fit the specific requirements of any project.


The original design intention of the XC4VSX25-12FFG668C chip was to provide a reliable, cost-effective solution for digital signal processing and other digital systems. It is equipped with a wide range of features that make it suitable for a variety of applications, such as high-speed serial communication, video processing, and digital signal processing. It also has the capability to be upgraded to meet the needs of more advanced systems.


The XC4VSX25-12FFG668C chip can be used for a variety of digital systems, including communication systems. It has a number of features that make it suitable for use in advanced communication systems, such as its high-speed serial communication capability, its ability to support multiple data rates, and its ability to handle large amounts of data. However, it is important to note that the chip has certain limitations which must be taken into account when designing a communication system. For example, it is not suitable for use in systems that require high levels of security or encryption.


The XC4VSX25-12FFG668C chip can also be used in the development and popularization of future intelligent robots. The chip is equipped with a powerful processor, allowing it to be used for complex tasks such as artificial intelligence and machine learning. However, it is important to note that the chip requires a high level of technical expertise in order to be used effectively. In addition, it is important to ensure that the chip is properly configured and programmed, as it can be difficult to debug and troubleshoot.


In conclusion, the XC4VSX25-12FFG668C chip is a powerful and versatile FPGA device that can be used for a variety of digital systems, including advanced communication systems and future intelligent robots. It has the flexibility to be tailored to meet the specific requirements of any project, and it can be upgraded to meet the needs of more advanced systems. However, it is important to note that the chip requires a high level of technical expertise in order to be used effectively.



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