AMD Xilinx
XC4VLX60-12FFG668C
XC4VLX60-12FFG668C ECAD Model
XC4VLX60-12FFG668C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Supply Voltage-Nom | 1.2 V | |
| Number of Inputs | 448 | |
| Number of Outputs | 448 | |
| Number of Logic Cells | 59904 | |
| Number of CLBs | 6656 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 6656 CLBS | |
| Clock Frequency-Max | 1.205 GHz | |
| Supply Voltage-Max | 1.26 V | |
| Supply Voltage-Min | 1.14 V | |
| JESD-30 Code | S-PBGA-B668 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 668 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA668,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.85 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | LEAD FREE, FBGA-668 | |
| Pin Count | 668 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | 3A991.D |
XC4VLX60-12FFG668C Datasheet Download
XC4VLX60-12FFG668C Overview
The XC4VLX60-12FFG668C chip model is a powerful solution for high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language, a hardware description language, to program the chip and make it work. This chip model has the potential to be applied to a wide range of scenarios, from networks to intelligent systems.
The chip model is capable of handling complex data processing tasks and is suitable for use in the development of future intelligent robots. This chip model is capable of providing the computing power needed for robots to complete more complex tasks. It can also be used to develop intelligent systems for various applications, such as autonomous vehicles, smart homes, and industrial automation.
The chip model is also suitable for use in the era of fully intelligent systems. The chip model is capable of handling large amounts of data and can be used to power intelligent systems that can make decisions based on the data they receive. This chip model is also capable of providing the computing power needed for the development of artificial intelligence algorithms.
To use the XC4VLX60-12FFG668C chip model effectively, technical talents with a background in HDL programming are needed. The chip model requires the use of HDL language, which is a complex language that requires a deep understanding of the chip model and its underlying architecture. Experienced HDL programmers are needed to ensure that the chip model is programmed correctly and that it is able to perform the desired tasks.
In conclusion, the XC4VLX60-12FFG668C chip model is a powerful solution for high-performance digital signal processing, embedded processing, and image processing. It has the potential to be applied to a wide range of scenarios, from networks to intelligent systems. It is also suitable for use in the era of fully intelligent systems and can be used to power intelligent robots and systems. To use the chip model effectively, technical talents with a background in HDL programming are needed.
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2,490 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $1,074.5592 | $1,074.5592 |
| 10+ | $1,063.0048 | $10,630.0480 |
| 100+ | $1,005.2328 | $100,523.2800 |
| 1000+ | $947.4608 | $473,730.4000 |
| 10000+ | $866.5800 | $866,580.0000 |
| The price is for reference only, please refer to the actual quotation! | ||