XC4VLX40-12FFG668C
XC4VLX40-12FFG668C
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rohs

AMD Xilinx

XC4VLX40-12FFG668C


XC4VLX40-12FFG668C
F20-XC4VLX40-12FFG668C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, LEAD FREE, FBGA-668
LEAD FREE, FBGA-668

XC4VLX40-12FFG668C ECAD Model


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XC4VLX40-12FFG668C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Inputs 448
Number of Outputs 448
Number of Logic Cells 41472
Number of CLBs 4608
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 4608 CLBS
Clock Frequency-Max 1.205 GHz
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B668
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 668
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA668,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm
Length 27 mm
Seated Height-Max 2.85 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description LEAD FREE, FBGA-668
Pin Count 668
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01

XC4VLX40-12FFG668C Datasheet Download


XC4VLX40-12FFG668C Overview



The XC4VLX40-12FFG668C chip model is a versatile and powerful chip that has been gaining traction in the industry for its advanced features and capabilities. It is designed to be used in a wide range of applications, from consumer electronics to industrial automation. This chip model is designed to be used in networks, and it has the potential to be used in the era of fully intelligent systems.


The design of the XC4VLX40-12FFG668C chip model is based on a Xilinx Virtex-4 FPGA architecture, which is a high-performance, low-power FPGA that is used in a variety of applications. The chip model includes a number of features, such as a high-speed transceiver, high-speed I/O, and high-speed memory. It also has the ability to support advanced technologies such as Ethernet, USB, and PCI Express.


The XC4VLX40-12FFG668C chip model is capable of providing high-speed data transmission, as well as providing reliable and secure communications. It can be used to provide support for a wide range of applications, including industrial automation, consumer electronics, and communication networks. It can also be used to support the development of new technologies, such as artificial intelligence and machine learning.


In terms of product description and design requirements, the XC4VLX40-12FFG668C chip model is designed to be used in a wide range of applications. It has a number of features, such as a high-speed transceiver, high-speed I/O, and high-speed memory. Additionally, it is designed to be used in a wide range of applications, from consumer electronics to industrial automation.


The XC4VLX40-12FFG668C chip model can be used in a variety of applications, including industrial automation, consumer electronics, and communication networks. It can also be used to support the development of new technologies, such as artificial intelligence and machine learning. Additionally, it can be used in a variety of intelligent scenarios, such as autonomous vehicles and smart homes.


When using the XC4VLX40-12FFG668C chip model, it is important to consider the specific design requirements, as well as the actual case studies and precautions. It is important to ensure that the chip model is properly configured and that the necessary precautions are taken to ensure that it is properly used. Additionally, it is important to consider the industry trends and future development of related industries, as well as whether the application environment requires the support of new technologies.


Overall, the XC4VLX40-12FFG668C chip model is a versatile and powerful chip that can be used in a wide range of applications. It has the potential to be used in the era of fully intelligent systems, and it can be used to support the development of new technologies, such as artificial intelligence and machine learning. When using the chip model, it is important to consider the specific design requirements, as well as the actual case studies and precautions. Additionally, it is important to consider the industry trends and future development of related industries, as well as whether the application environment requires the support of new technologies.



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Unit Price: $757.12
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Pricing (USD)

QTY Unit Price Ext Price
1+ $704.1216 $704.1216
10+ $696.5504 $6,965.5040
100+ $658.6944 $65,869.4400
1000+ $620.8384 $310,419.2000
10000+ $567.8400 $567,840.0000
The price is for reference only, please refer to the actual quotation!

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