
AMD Xilinx
XC4VSX25-11FFG668I
XC4VSX25-11FFG668I ECAD Model
XC4VSX25-11FFG668I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 320 | |
Number of Outputs | 320 | |
Number of Logic Cells | 23040 | |
Number of CLBs | 2560 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 2560 CLBS | |
Clock Frequency-Max | 1.205 GHz | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B668 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 250 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 668 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA668,26X26,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.85 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | LEAD FREE, FBGA-668 | |
Pin Count | 668 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 |
XC4VSX25-11FFG668I Datasheet Download
XC4VSX25-11FFG668I Overview
The Xilinx XC4VSX25-11FFG668I chip model is a powerful and versatile system on a chip (SoC) that provides a wide range of features and capabilities. It is a great choice for many embedded applications, including networking and intelligent systems. This chip model is designed to be efficient and cost-effective, making it an attractive option for embedded applications.
The XC4VSX25-11FFG668I chip model has several advantages over other chip models. It has a low power consumption, a high-speed clock frequency, and a wide range of integrated peripherals. It also supports multiple operating systems, including Linux and Windows. These features make it an ideal choice for embedded applications that require high performance and low power consumption.
The demand for the XC4VSX25-11FFG668I chip model is expected to grow in the future, as more applications require its features and capabilities. This chip model can be used in a variety of networking and intelligent scenarios, such as machine learning and artificial intelligence. It can also be used in the development and popularization of future intelligent robots.
In the era of fully intelligent systems, the XC4VSX25-11FFG668I chip model can be used to create powerful and efficient embedded applications. It is capable of handling complex tasks, such as natural language processing and video processing. It is also capable of providing high-speed data transfer, making it a great choice for applications that require fast data processing.
To effectively use the XC4VSX25-11FFG668I chip model, technical talents are needed. This chip model requires knowledge of embedded systems, programming languages, and hardware design. It also requires a deep understanding of the chip model’s features and capabilities, as well as its limitations. With the right expertise, the XC4VSX25-11FFG668I chip model can be used to create powerful and efficient applications for the future.
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5,357 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $502.9440 | $502.9440 |
10+ | $497.5360 | $4,975.3600 |
100+ | $470.4960 | $47,049.6000 |
1000+ | $443.4560 | $221,728.0000 |
10000+ | $405.6000 | $405,600.0000 |
The price is for reference only, please refer to the actual quotation! |