
AMD Xilinx
XC4VFX140-12FFG1760C
XC4VFX140-12FFG1760C ECAD Model
XC4VFX140-12FFG1760C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 896 | |
Number of Outputs | 896 | |
Number of Logic Cells | 142128 | |
Number of CLBs | 15792 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 15792 CLBS | |
Clock Frequency-Max | 1.181 GHz | |
Power Supplies | 1.2,1.2/3.3,2.5 V | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B1760 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1760 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1760,42X42,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
Part Package Code | BGA | |
Package Description | 42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760 | |
Pin Count | 1760 |
XC4VFX140-12FFG1760C Datasheet Download
XC4VFX140-12FFG1760C Overview
The chip model XC4VFX140-12FFG1760C has been widely used in the semiconductor industry, and it has become an essential component for many electronic devices. With the rapid development of technology, the chip model XC4VFX140-12FFG1760C has become increasingly popular in the market. As a result, the industry trends of the chip model XC4VFX140-12FFG1760C and the future development of related industries are of great importance.
The chip model XC4VFX140-12FFG1760C has many advantages, such as low power consumption, high performance and high integration. It is suitable for the development of many electronic products, such as mobile phones, tablets, computers and other intelligent devices. In the future, the demand for the chip model XC4VFX140-12FFG1760C will continue to increase, and more applications will be developed.
In addition, the chip model XC4VFX140-12FFG1760C can also be used in the development and popularization of future intelligent robots. This requires the support of new technologies, such as artificial intelligence, machine learning, and deep learning. To use the chip model XC4VFX140-12FFG1760C effectively, technical talents such as software engineers, hardware engineers, and data scientists are needed.
In conclusion, the chip model XC4VFX140-12FFG1760C has become an essential component for many electronic devices, and its demand will continue to increase in the future. It can be used in the development and popularization of future intelligent robots, but this requires the support of new technologies and the help of technical talents.
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QTY | Unit Price | Ext Price |
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