XC4VFX140-12FFG1760C
XC4VFX140-12FFG1760C
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rohs

AMD Xilinx

XC4VFX140-12FFG1760C


XC4VFX140-12FFG1760C
F20-XC4VFX140-12FFG1760C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760
42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760

XC4VFX140-12FFG1760C ECAD Model


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XC4VFX140-12FFG1760C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Inputs 896
Number of Outputs 896
Number of Logic Cells 142128
Number of CLBs 15792
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 15792 CLBS
Clock Frequency-Max 1.181 GHz
Power Supplies 1.2,1.2/3.3,2.5 V
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B1760
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1760
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1760,42X42,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
Part Package Code BGA
Package Description 42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760
Pin Count 1760

XC4VFX140-12FFG1760C Datasheet Download


XC4VFX140-12FFG1760C Overview



The chip model XC4VFX140-12FFG1760C has been widely used in the semiconductor industry, and it has become an essential component for many electronic devices. With the rapid development of technology, the chip model XC4VFX140-12FFG1760C has become increasingly popular in the market. As a result, the industry trends of the chip model XC4VFX140-12FFG1760C and the future development of related industries are of great importance.


The chip model XC4VFX140-12FFG1760C has many advantages, such as low power consumption, high performance and high integration. It is suitable for the development of many electronic products, such as mobile phones, tablets, computers and other intelligent devices. In the future, the demand for the chip model XC4VFX140-12FFG1760C will continue to increase, and more applications will be developed.


In addition, the chip model XC4VFX140-12FFG1760C can also be used in the development and popularization of future intelligent robots. This requires the support of new technologies, such as artificial intelligence, machine learning, and deep learning. To use the chip model XC4VFX140-12FFG1760C effectively, technical talents such as software engineers, hardware engineers, and data scientists are needed.


In conclusion, the chip model XC4VFX140-12FFG1760C has become an essential component for many electronic devices, and its demand will continue to increase in the future. It can be used in the development and popularization of future intelligent robots, but this requires the support of new technologies and the help of technical talents.



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