XC4VFX140-12FF1760C
XC4VFX140-12FF1760C
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AMD Xilinx

XC4VFX140-12FF1760C

XC4VFX140-12FF1760C
AMD Xilinx
F20-XC4VFX140-12FF1760C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760
42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760
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XC4VFX140-12FF1760C Datasheet (PDF)
XC4VFX140-12FF1760C Document (PDF)

XC4VFX140-12FF1760C ECAD Model

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XC4VFX140-12FF1760C Attributes

Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Inputs 896
Number of Outputs 896
Number of Logic Cells 142128
Number of CLBs 15792
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 15792 CLBS
Clock Frequency-Max 1.181 GHz
Power Supplies 1.2,1.2/3.3,2.5 V
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B1760
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1760
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1760,42X42,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
Part Package Code BGA
Package Description 42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760
Pin Count 1760

XC4VFX140-12FF1760C Datasheet Download

XC4VFX140-12FF1760C Overview


The XC4VFX140-12FF1760C chip model is a high-performance, low-power FPGA (Field Programmable Gate Array) designed specifically for the needs of the networking industry. It is a powerful and versatile solution that can be used in a wide range of applications, including network infrastructure, data centers, and edge computing.


The XC4VFX140-12FF1760C chip model offers a number of advantages, such as its low power consumption, high performance, and high scalability. It is capable of handling large amounts of data, making it an ideal choice for applications that require high throughput. The chip also offers advanced features such as dynamic reconfiguration, which allows for quickly and easily changing the configuration of the chip as needed.


The XC4VFX140-12FF1760C chip model is expected to be in high demand in the future, due to its ability to meet the needs of the ever-evolving networking industry. The chip can be used in a variety of intelligent scenarios, including virtualization, cloud computing, and artificial intelligence (AI). It is also capable of being used in the era of fully intelligent systems, such as the Internet of Things (IoT).


The XC4VFX140-12FF1760C chip model is designed to meet specific design requirements, including a wide range of I/O interfaces, high speed transceivers, and low power consumption. It also has a variety of features, such as high-speed memory, advanced logic, and programmable interconnects. Additionally, the chip model offers a range of security features, such as secure boot, anti-tampering, and encryption.


There are a number of case studies that demonstrate the effectiveness of the XC4VFX140-12FF1760C chip model. One such example is the use of the chip in a medical device, where it was used to improve the accuracy of the device’s readings. The chip was also used in a smart home system, where it enabled the system to be more responsive to user commands.


When using the XC4VFX140-12FF1760C chip model, it is important to take certain precautions. For example, it is important to ensure that the chip is properly configured, as incorrect configurations can lead to unexpected behavior. Additionally, it is important to ensure that the chip is properly cooled, as overheating can cause the chip to malfunction.


In conclusion, the XC4VFX140-12FF1760C chip model is a powerful and versatile solution that can be used in a wide range of applications. It offers a number of advantages, such as low power consumption, high performance, and high scalability. The chip is expected to be in high demand in the future, and it can be used in a variety of intelligent scenarios. Additionally, the chip is designed to meet specific design requirements and it offers a range of security features. When using the chip, it is important to take certain precautions, such as ensuring that the chip is properly configured and cooled.



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Parts Index

XC4VFX140-12FF1760
2
XC4VFX140-12FF
10
XC4VFX140-12
10
XC4VFX140-
50
XC4VFX140
50
XC4VFX
314
XC4
5493
XC
65616