
AMD Xilinx
XC4VFX140-11FFG1760C
XC4VFX140-11FFG1760C ECAD Model
XC4VFX140-11FFG1760C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 896 | |
Number of Outputs | 896 | |
Number of Logic Cells | 142128 | |
Number of CLBs | 15792 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 15792 CLBS | |
Clock Frequency-Max | 1.205 GHz | |
Power Supplies | 1.2,1.2/3.3,2.5 V | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B1760 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1760 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1760,42X42,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
Package Description | 42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760 | |
Part Package Code | BGA | |
Pin Count | 1760 |
XC4VFX140-11FFG1760C Datasheet Download
XC4VFX140-11FFG1760C Overview
The chip model XC4VFX140-11FFG1760C is an innovative product developed by Xilinx, Inc. It is designed for applications where high performance, low power consumption, and flexibility are required. This chip model is suitable for use in a variety of applications, including networking, embedded systems, and digital signal processing.
The XC4VFX140-11FFG1760C is a high-performance and low-power FPGA with a large number of logic cells, which makes it suitable for a wide range of applications. It has a wide range of features, including a high-speed transceiver, a high-speed serial interface, and a high-speed serial interface. Additionally, it has an integrated memory controller and a high-speed memory interface. This chip model is also capable of supporting a wide range of software and hardware development tools, making it suitable for a wide range of applications.
The industry trends of the XC4VFX140-11FFG1760C chip model are constantly changing. As new technologies are developed, the chip model is expected to be able to support them. It is also possible that the chip model may be upgraded in the future to support more advanced communication systems. Additionally, the chip model may be used in networks and intelligent scenarios in the future.
The XC4VFX140-11FFG1760C chip model is designed to provide high performance, low power consumption, and flexibility. It is a versatile chip model that can be used in a variety of applications. It has the capability to support a wide range of software and hardware development tools, making it suitable for a wide range of applications. Additionally, it is possible that the chip model may be upgraded in the future to support more advanced communication systems and intelligent scenarios. Therefore, the industry trends of the XC4VFX140-11FFG1760C chip model and the future development of related industries are constantly changing, and it depends on what specific technologies are needed in the application environment.
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