XC4VFX140-11FFG1760C
XC4VFX140-11FFG1760C
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rohs

AMD Xilinx

XC4VFX140-11FFG1760C


XC4VFX140-11FFG1760C
F20-XC4VFX140-11FFG1760C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760
42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760

XC4VFX140-11FFG1760C ECAD Model


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XC4VFX140-11FFG1760C Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Inputs 896
Number of Outputs 896
Number of Logic Cells 142128
Number of CLBs 15792
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 15792 CLBS
Clock Frequency-Max 1.205 GHz
Power Supplies 1.2,1.2/3.3,2.5 V
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B1760
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1760
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1760,42X42,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
Package Description 42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760
Part Package Code BGA
Pin Count 1760

XC4VFX140-11FFG1760C Datasheet Download


XC4VFX140-11FFG1760C Overview



The chip model XC4VFX140-11FFG1760C is an innovative product developed by Xilinx, Inc. It is designed for applications where high performance, low power consumption, and flexibility are required. This chip model is suitable for use in a variety of applications, including networking, embedded systems, and digital signal processing.


The XC4VFX140-11FFG1760C is a high-performance and low-power FPGA with a large number of logic cells, which makes it suitable for a wide range of applications. It has a wide range of features, including a high-speed transceiver, a high-speed serial interface, and a high-speed serial interface. Additionally, it has an integrated memory controller and a high-speed memory interface. This chip model is also capable of supporting a wide range of software and hardware development tools, making it suitable for a wide range of applications.


The industry trends of the XC4VFX140-11FFG1760C chip model are constantly changing. As new technologies are developed, the chip model is expected to be able to support them. It is also possible that the chip model may be upgraded in the future to support more advanced communication systems. Additionally, the chip model may be used in networks and intelligent scenarios in the future.


The XC4VFX140-11FFG1760C chip model is designed to provide high performance, low power consumption, and flexibility. It is a versatile chip model that can be used in a variety of applications. It has the capability to support a wide range of software and hardware development tools, making it suitable for a wide range of applications. Additionally, it is possible that the chip model may be upgraded in the future to support more advanced communication systems and intelligent scenarios. Therefore, the industry trends of the XC4VFX140-11FFG1760C chip model and the future development of related industries are constantly changing, and it depends on what specific technologies are needed in the application environment.



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