XC4VFX140-11FFG1760I
XC4VFX140-11FFG1760I
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rohs

AMD Xilinx

XC4VFX140-11FFG1760I


XC4VFX140-11FFG1760I
F20-XC4VFX140-11FFG1760I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760
42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760

XC4VFX140-11FFG1760I ECAD Model


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XC4VFX140-11FFG1760I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of Inputs 896
Number of Outputs 896
Number of Logic Cells 142128
Number of CLBs 15792
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 15792 CLBS
Clock Frequency-Max 1.205 GHz
Power Supplies 1.2,1.2/3.3,2.5 V
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B1760
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 4
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1760
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1760,42X42,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
Part Package Code BGA
Package Description 42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760
Pin Count 1760

XC4VFX140-11FFG1760I Datasheet Download


XC4VFX140-11FFG1760I Overview



The Xilinx XC4VFX140-11FFG1760I chip model is a powerful and versatile integrated circuit that has many advantages in various industries. It is designed to be used in a wide range of applications, from network infrastructure to intelligent robots. The chip model is designed to be used in the era of fully intelligent systems, and its features make it an ideal choice for many applications.


The XC4VFX140-11FFG1760I chip model has a number of advantages that make it attractive to many industries. It has a wide range of features, including a high-speed processing core, a large number of I/O ports, and a flexible FPGA architecture. Additionally, the chip model is highly reliable, with a low power consumption and a long lifespan. As a result, the XC4VFX140-11FFG1760I chip model is expected to experience a high demand in the future, as more and more industries begin to use the chip for their applications.


The XC4VFX140-11FFG1760I chip model can be used in a variety of network applications, from edge computing to cloud computing. Additionally, the chip model can be used in a number of intelligent scenarios, such as facial recognition, natural language processing, and autonomous navigation. The XC4VFX140-11FFG1760I chip model can also be used to develop and popularize future intelligent robots, as it has a wide range of features that make it suitable for such applications.


In order to use the XC4VFX140-11FFG1760I chip model effectively, a number of technical talents are needed. This includes knowledge of the FPGA architecture, experience in programming and debugging, and a good understanding of the chip model’s features. Additionally, those who plan to use the chip model for network applications and intelligent scenarios should have a good understanding of the related technologies and be familiar with the related standards.


In conclusion, the Xilinx XC4VFX140-11FFG1760I chip model is an ideal choice for many industries, as it has a wide range of features and advantages. The chip model is expected to experience a high demand in the future, as more and more industries begin to use the chip for their applications. Additionally, the chip model can be used in a variety of network applications and intelligent scenarios, and it can also be used to develop and popularize future intelligent robots. Those who plan to use the chip model effectively should have a good understanding of the FPGA architecture, experience in programming and debugging, and a good understanding of the chip model’s features.



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