
AMD Xilinx
XC4VFX140-11FFG1760I
XC4VFX140-11FFG1760I ECAD Model
XC4VFX140-11FFG1760I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of Inputs | 896 | |
Number of Outputs | 896 | |
Number of Logic Cells | 142128 | |
Number of CLBs | 15792 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 15792 CLBS | |
Clock Frequency-Max | 1.205 GHz | |
Power Supplies | 1.2,1.2/3.3,2.5 V | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B1760 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1760 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1760,42X42,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
Part Package Code | BGA | |
Package Description | 42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760 | |
Pin Count | 1760 |
XC4VFX140-11FFG1760I Datasheet Download
XC4VFX140-11FFG1760I Overview
The Xilinx XC4VFX140-11FFG1760I chip model is a powerful and versatile integrated circuit that has many advantages in various industries. It is designed to be used in a wide range of applications, from network infrastructure to intelligent robots. The chip model is designed to be used in the era of fully intelligent systems, and its features make it an ideal choice for many applications.
The XC4VFX140-11FFG1760I chip model has a number of advantages that make it attractive to many industries. It has a wide range of features, including a high-speed processing core, a large number of I/O ports, and a flexible FPGA architecture. Additionally, the chip model is highly reliable, with a low power consumption and a long lifespan. As a result, the XC4VFX140-11FFG1760I chip model is expected to experience a high demand in the future, as more and more industries begin to use the chip for their applications.
The XC4VFX140-11FFG1760I chip model can be used in a variety of network applications, from edge computing to cloud computing. Additionally, the chip model can be used in a number of intelligent scenarios, such as facial recognition, natural language processing, and autonomous navigation. The XC4VFX140-11FFG1760I chip model can also be used to develop and popularize future intelligent robots, as it has a wide range of features that make it suitable for such applications.
In order to use the XC4VFX140-11FFG1760I chip model effectively, a number of technical talents are needed. This includes knowledge of the FPGA architecture, experience in programming and debugging, and a good understanding of the chip model’s features. Additionally, those who plan to use the chip model for network applications and intelligent scenarios should have a good understanding of the related technologies and be familiar with the related standards.
In conclusion, the Xilinx XC4VFX140-11FFG1760I chip model is an ideal choice for many industries, as it has a wide range of features and advantages. The chip model is expected to experience a high demand in the future, as more and more industries begin to use the chip for their applications. Additionally, the chip model can be used in a variety of network applications and intelligent scenarios, and it can also be used to develop and popularize future intelligent robots. Those who plan to use the chip model effectively should have a good understanding of the FPGA architecture, experience in programming and debugging, and a good understanding of the chip model’s features.
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