XC4VFX140-11FF1760I
XC4VFX140-11FF1760I
Image shown is a representation only, Exact specifications should be obtained from the product data sheet.
rohs

AMD Xilinx

XC4VFX140-11FF1760I

XC4VFX140-11FF1760I
AMD Xilinx
F20-XC4VFX140-11FF1760I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760
42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760
Call for availability
XC4VFX140-11FF1760I Datasheet (PDF)
XC4VFX140-11FF1760I Document (PDF)

XC4VFX140-11FF1760I ECAD Model

Download the free Library Loader to convert this file for your ECAD Tool. Learn more about ECAD Model.

XC4VFX140-11FF1760I Attributes

Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of CLBs 15792
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 15792 CLBS
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B1760
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1760
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760
Pin Count 1760
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC4VFX140-11FF1760I Datasheet Download

XC4VFX140-11FF1760I Overview


The XC4VFX140-11FF1760I chip model is a cutting-edge integrated circuit technology developed by Xilinx Corporation. It is designed to provide high-performance, low-power, and cost-effective solutions for a wide range of applications. This model is ideal for high-end embedded systems and wireless communication systems, as well as for data centers, cloud computing, and artificial intelligence applications.


The XC4VFX140-11FF1760I chip model features a range of features that make it an attractive choice for many industries. It is equipped with an advanced FPGA fabric that provides high-speed data processing and routing capabilities. It also has a high-speed memory interface, allowing users to quickly and efficiently access data from their applications. Additionally, the chip model is designed with a low-power architecture, which helps to reduce power consumption and reduce the overall cost of ownership for the system.


In terms of industry trends, the XC4VFX140-11FF1760I chip model is expected to be increasingly popular in the future. This is due to its ability to provide high-performance solutions for a variety of applications. In addition, the chip model’s low-power architecture makes it an ideal choice for applications that require energy efficiency. Furthermore, the chip model’s advanced FPGA fabric makes it an attractive option for applications that require high-speed data processing and routing capabilities.


The original design intention of the XC4VFX140-11FF1760I chip model was to provide a cost-effective solution for a variety of applications. In terms of future upgrades, the chip model is expected to remain compatible with the latest technologies. This means that the chip model can be used in advanced communication systems, such as 5G networks, as well as in artificial intelligence applications. Additionally, the chip model is designed to be upgradable, so users can easily upgrade their systems as new technologies become available.


Overall, the XC4VFX140-11FF1760I chip model is a cutting-edge integrated circuit technology that offers a range of features that make it an attractive choice for many industries. It is designed to provide high-performance, low-power, and cost-effective solutions for a variety of applications. In terms of industry trends, the chip model is expected to be increasingly popular in the future, and it is designed to be compatible with the latest technologies. Additionally, the chip model is designed to be upgradable, so users can easily upgrade their systems as new technologies become available.



Display All

You May Also Be Interested In

XC4VFX140-10FF1760C
AMD Xilinx
XC4VFX140-10FF1760C
Description: FIELD PROGRAMMABLE GATE ARRAY, CMOS, 42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760
Package: 42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760
XC4VFX140-11FF1760C
AMD Xilinx
XC4VFX140-11FF1760C
Description: FIELD PROGRAMMABLE GATE ARRAY, CMOS, 42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760
Package: 42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760
XC4VFX140-12FFG1760C
AMD Xilinx
XC4VFX140-12FFG1760C
Description: FIELD PROGRAMMABLE GATE ARRAY, CMOS, 42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760
Package: 42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760
XC4VFX140-12FF1760C
AMD Xilinx
XC4VFX140-12FF1760C
Description: FIELD PROGRAMMABLE GATE ARRAY, CMOS, 42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760
Package: 42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760
XC4VFX140-11FFG1760I
AMD Xilinx
XC4VFX140-11FFG1760I
Description: FIELD PROGRAMMABLE GATE ARRAY, CMOS, 42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760
Package: 42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760
XC4VFX140-11FFG1760C
AMD Xilinx
XC4VFX140-11FFG1760C
Description: FIELD PROGRAMMABLE GATE ARRAY, CMOS, 42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760
Package: 42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760

5,802 In Stock

I want to buy
Unit Price: N/A
paypal mastercard unionpay dhl fedex ups

Pricing (USD)

QTY Unit Price Ext Price
No reference price found.

Quick Quote

Parts Index

XC4VFX140-11FF1760
2
XC4VFX140-11FF
14
XC4VFX140-11
18
XC4VFX140-
50
XC4VFX140
50
XC4VFX
314
XC4
5493
XC
65616