
AMD Xilinx
XC4VFX140-10FF1760I
XC4VFX140-10FF1760I ECAD Model
XC4VFX140-10FF1760I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Active | |
Supply Voltage-Nom | 1.2 V | |
Number of CLBs | 15792 | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 15792 CLBS | |
Supply Voltage-Max | 1.26 V | |
Supply Voltage-Min | 1.14 V | |
JESD-30 Code | S-PBGA-B1760 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1760 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 3.5 mm | |
Ihs Manufacturer | XILINX INC | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
Part Package Code | BGA | |
Package Description | 42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760 | |
Pin Count | 1760 |
XC4VFX140-10FF1760I Datasheet Download
XC4VFX140-10FF1760I Overview
The XC4VFX140-10FF1760I chip model is a high-performance, high-density, low-power field-programmable gate array (FPGA) device that utilizes the Virtex-4 architecture. It is suitable for applications requiring high-performance digital signal processing, embedded processing, and image processing. This chip model is designed to be programmed using a hardware description language (HDL), such as VHDL, Verilog, or SystemVerilog.
The XC4VFX140-10FF1760I chip model provides several advantages, such as low power consumption, high performance, and high density. It also offers a high level of flexibility, allowing users to quickly and easily customize the device for their specific application requirements. Furthermore, this chip model features advanced features, such as embedded memory blocks, digital signal processing blocks, and high-speed serial transceivers.
The XC4VFX140-10FF1760I chip model is expected to see increasing demand in a variety of industries, such as automotive, aerospace, medical, and industrial. This is due to its ability to meet the demands of these industries for high-performance, low-power, and high-density devices. Furthermore, this chip model is expected to be used in advanced communication systems, as it has the capability to support high-speed data transmission.
The original design intention of the XC4VFX140-10FF1760I chip model was to provide a high-performance, low-power, and high-density FPGA device for a variety of applications. This chip model is also capable of being upgraded, allowing users to take advantage of new features and technologies as they become available. Furthermore, this chip model can be used in advanced communication systems, as it has the capability to support high-speed data transmission.
In conclusion, the XC4VFX140-10FF1760I chip model is a high-performance, low-power, and high-density FPGA device that is suitable for applications requiring high-performance digital signal processing, embedded processing, and image processing. It is expected to see increasing demand in a variety of industries, and is capable of being upgraded, allowing users to take advantage of new features and technologies as they become available. Furthermore, this chip model can be used in advanced communication systems, as it has the capability to support high-speed data transmission.
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2,074 In Stock






Pricing (USD)
QTY | Unit Price | Ext Price |
---|---|---|
1+ | $1,622.5457 | $1,622.5457 |
10+ | $1,605.0990 | $16,050.9898 |
100+ | $1,517.8653 | $151,786.5336 |
1000+ | $1,430.6317 | $715,315.8480 |
10000+ | $1,308.5046 | $1,308,504.6000 |
The price is for reference only, please refer to the actual quotation! |