XC4VFX140-10FF1760I
XC4VFX140-10FF1760I
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rohs

AMD Xilinx

XC4VFX140-10FF1760I


XC4VFX140-10FF1760I
F20-XC4VFX140-10FF1760I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760
42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760

XC4VFX140-10FF1760I ECAD Model


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XC4VFX140-10FF1760I Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Active
Supply Voltage-Nom 1.2 V
Number of CLBs 15792
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 15792 CLBS
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
JESD-30 Code S-PBGA-B1760
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1760
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 3.5 mm
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
Part Package Code BGA
Package Description 42.50 X 42.50 MM, 1 MM PITCH, MS-034-AAV-1, FBGA-1760
Pin Count 1760

XC4VFX140-10FF1760I Datasheet Download


XC4VFX140-10FF1760I Overview



The XC4VFX140-10FF1760I chip model is a high-performance, high-density, low-power field-programmable gate array (FPGA) device that utilizes the Virtex-4 architecture. It is suitable for applications requiring high-performance digital signal processing, embedded processing, and image processing. This chip model is designed to be programmed using a hardware description language (HDL), such as VHDL, Verilog, or SystemVerilog.


The XC4VFX140-10FF1760I chip model provides several advantages, such as low power consumption, high performance, and high density. It also offers a high level of flexibility, allowing users to quickly and easily customize the device for their specific application requirements. Furthermore, this chip model features advanced features, such as embedded memory blocks, digital signal processing blocks, and high-speed serial transceivers.


The XC4VFX140-10FF1760I chip model is expected to see increasing demand in a variety of industries, such as automotive, aerospace, medical, and industrial. This is due to its ability to meet the demands of these industries for high-performance, low-power, and high-density devices. Furthermore, this chip model is expected to be used in advanced communication systems, as it has the capability to support high-speed data transmission.


The original design intention of the XC4VFX140-10FF1760I chip model was to provide a high-performance, low-power, and high-density FPGA device for a variety of applications. This chip model is also capable of being upgraded, allowing users to take advantage of new features and technologies as they become available. Furthermore, this chip model can be used in advanced communication systems, as it has the capability to support high-speed data transmission.


In conclusion, the XC4VFX140-10FF1760I chip model is a high-performance, low-power, and high-density FPGA device that is suitable for applications requiring high-performance digital signal processing, embedded processing, and image processing. It is expected to see increasing demand in a variety of industries, and is capable of being upgraded, allowing users to take advantage of new features and technologies as they become available. Furthermore, this chip model can be used in advanced communication systems, as it has the capability to support high-speed data transmission.



2,074 In Stock


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Unit Price: $1,744.6728
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Pricing (USD)

QTY Unit Price Ext Price
1+ $1,622.5457 $1,622.5457
10+ $1,605.0990 $16,050.9898
100+ $1,517.8653 $151,786.5336
1000+ $1,430.6317 $715,315.8480
10000+ $1,308.5046 $1,308,504.6000
The price is for reference only, please refer to the actual quotation!

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