AMD Xilinx
XC3195A-4PP175C
XC3195A-4PP175C ECAD Model
XC3195A-4PP175C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 484 | |
| Number of Equivalent Gates | 6500 | |
| Number of CLBs | 484 | |
| Combinatorial Delay of a CLB-Max | 3.3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 484 CLBS, 6500 GATES | |
| Additional Feature | MAX USABLE 7500 LOGIC GATES | |
| Clock Frequency-Max | 227 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PPGA-P175 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 175 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HPGA | |
| Package Equivalence Code | PGA175,16X16 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | NO | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 4.191 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | HPGA, PGA175,16X16 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | PGA | |
| Pin Count | 175 |
XC3195A-4PP175C Datasheet Download
XC3195A-4PP175C Overview
The XC3195A-4PP175C chip model is a high-performance, low-power device that is suitable for digital signal processing, embedded processing, and image processing. It is an ideal choice for those who require flexibility and performance in their applications. The chip model is designed to be used with the HDL (Hardware Description Language) and is capable of providing a wide range of capabilities, such as high-speed data transfer, data storage, and communication.
The XC3195A-4PP175C chip model has several advantages, such as its low power consumption, high performance, and flexibility. It is also capable of supporting various types of applications, such as audio, video, and image processing. The chip model is also designed to be compatible with multiple operating systems, making it an ideal choice for those who require flexibility in their applications.
The demand for the XC3195A-4PP175C chip model is expected to grow in the future, as more and more applications require the use of this device. This is especially true in the area of embedded processing, as it is a versatile device that can be used for a variety of tasks. Additionally, the chip model is expected to be used in the development and popularization of future intelligent robots, as its flexibility and performance make it an ideal choice for such applications.
In order to effectively use the XC3195A-4PP175C chip model, certain technical skills are required. These include knowledge of HDL (Hardware Description Language), knowledge of digital signal processing, and knowledge of embedded processing. Additionally, those who wish to use the chip model effectively should have a good understanding of the various operating systems that the chip model is compatible with. With these skills, one can effectively use the chip model to create powerful applications and devices.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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