AMD Xilinx
XC3195A-4PG175I
XC3195A-4PG175I ECAD Model
XC3195A-4PG175I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 484 | |
| Number of Equivalent Gates | 6500 | |
| Number of CLBs | 484 | |
| Combinatorial Delay of a CLB-Max | 3.3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 484 CLBS, 6500 GATES | |
| Additional Feature | MAX USABLE 7500 LOGIC GATES | |
| Clock Frequency-Max | 227 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-CPGA-P175 | |
| Qualification Status | Not Qualified | |
| Number of Terminals | 175 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | HPGA | |
| Package Equivalence Code | PGA175,16X16 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 4.318 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | HPGA, PGA175,16X16 | |
| Pin Count | 175 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3195A-4PG175I Datasheet Download
XC3195A-4PG175I Overview
The XC3195A-4PG175I chip model is a powerful and versatile tool for digital signal processing, embedded processing, and image processing. It is designed to be compatible with the HDL language, allowing developers to create complex algorithms and applications quickly and easily.
The chip model is equipped with a wide range of features and capabilities, including an advanced power-saving architecture and a fast signal processing engine. It also has a high-speed memory interface that allows for rapid data transfer and a flexible interface for connecting external devices.
The XC3195A-4PG175I chip model is widely used in a variety of industries, including automotive, telecommunications, and medical. It has been adopted by many companies due to its low cost, high performance, and scalability.
The chip model is expected to remain popular in the future due to its ability to quickly and easily process complex algorithms. Its low cost and scalability make it attractive for companies looking for a cost-effective solution for their digital signal processing needs.
The chip model's use of the HDL language also makes it easy for developers to create applications and algorithms quickly and easily. This makes it an ideal choice for companies that need to quickly develop and deploy applications.
The XC3195A-4PG175I chip model is expected to remain in high demand in the future, as companies continue to look for ways to reduce costs and increase performance. Its scalability, low cost, and ease of use make it an attractive choice for companies that need to quickly develop and deploy applications.
The chip model's application environment may require the support of new technologies in the future, depending on what specific technologies are needed. Companies should keep an eye on industry trends and new technologies to ensure they are using the most up-to-date solutions for their digital signal processing needs.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||