AMD Xilinx
XC3195A-4PG175C
XC3195A-4PG175C ECAD Model
XC3195A-4PG175C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 484 | |
| Number of Equivalent Gates | 6500 | |
| Number of CLBs | 484 | |
| Combinatorial Delay of a CLB-Max | 3.3 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 484 CLBS, 6500 GATES | |
| Additional Feature | MAX USABLE 7500 LOGIC GATES | |
| Clock Frequency-Max | 227 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-CPGA-P175 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 175 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | HPGA | |
| Package Equivalence Code | PGA175,16X16 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 4.318 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | HPGA, PGA175,16X16 | |
| Pin Count | 175 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3195A-4PG175C Datasheet Download
XC3195A-4PG175C Overview
The XC3195A-4PG175C chip model is a powerful, highly efficient and cost-effective solution for a wide range of applications. This chip is designed to meet the needs of a variety of industries, such as automotive, industrial, medical, and consumer electronics. It offers high-performance features that make it an ideal choice for a variety of applications.
The XC3195A-4PG175C chip model is designed to provide a high level of performance, reliability and efficiency. It features an advanced, low-power, high-speed architecture that allows it to support a wide range of applications. It also has an integrated system-on-chip (SoC) design that provides a comprehensive set of features and capabilities. This chip is designed to support a variety of applications, including networking, automotive, industrial, medical and consumer electronics.
The XC3195A-4PG175C chip model offers a variety of advantages over other chip models. It has a low power consumption, high speed, and high efficiency that make it a great choice for a wide range of applications. It also has a low-cost design that makes it an economical solution for many applications. Additionally, it is designed to be highly reliable and has a long life cycle.
The XC3195A-4PG175C chip model is expected to have a high demand in the future due to its various advantages. It is expected to be used in a wide range of applications, including automotive, industrial, medical, and consumer electronics. It is also expected to be used in the era of fully intelligent systems, such as autonomous vehicles, smart factories and connected homes.
The XC3195A-4PG175C chip model is designed to meet specific design requirements. It has a low power consumption and high speed that make it a great choice for a wide range of applications. Additionally, it has a low-cost design that makes it an economical solution for many applications. It is also designed to be highly reliable and has a long life cycle.
The XC3195A-4PG175C chip model can be used in a variety of applications, including networking, automotive, industrial, medical, and consumer electronics. It is also suitable for a variety of intelligent scenarios, such as autonomous vehicles, smart factories, and connected homes. Additionally, it is suitable for use in the era of fully intelligent systems.
In order to ensure the successful use of the XC3195A-4PG175C chip model, it is important to consider the specific design requirements of the application. It is also important to consider the possible future applications and the intelligent scenarios that it may be applied to. Additionally, it is important to consider the possible future demand trends for the chip model and the precautions that should be taken when using it.
Overall, the XC3195A-4PG175C chip model is a powerful, highly efficient and cost-effective solution for a wide range of applications. It offers a variety of advantages over other chip models, including a low power consumption, high speed, and high efficiency. It is also expected to have a high demand in the future due to its various advantages. In order to ensure the successful use of the XC3195A-4PG175C chip model, it is important to consider the specific design requirements of the application, the possible future applications and the intelligent scenarios that it may be applied to, and the possible future demand trends for the chip model.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||