AMD Xilinx
XC3195A-3PP175I
XC3195A-3PP175I ECAD Model
XC3195A-3PP175I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 484 | |
| Number of Equivalent Gates | 6500 | |
| Number of CLBs | 484 | |
| Combinatorial Delay of a CLB-Max | 2.7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 484 CLBS, 6500 GATES | |
| Additional Feature | MAX USABLE 7500 LOGIC GATES | |
| Clock Frequency-Max | 270 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PPGA-P175 | |
| Qualification Status | Not Qualified | |
| Moisture Sensitivity Level | 1 | |
| Number of Terminals | 175 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HPGA | |
| Package Equivalence Code | PGA175,16X16 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 4.191 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | HPGA, PGA175,16X16 | |
| Pin Count | 175 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3195A-3PP175I Datasheet Download
XC3195A-3PP175I Overview
The XC3195A-3PP175I chip model is a powerful and versatile integrated circuit developed by the Xilinx Corporation. It is designed to provide robust and reliable solutions to a wide range of communication and networking applications. This chip model is capable of handling up to 175 MHz frequency and up to 3.3V power supply. It is also featured with a wide range of programmable logic and memory, making it an ideal component for advanced communication systems.
The XC3195A-3PP175I chip model is designed to provide the highest performance, reliability, and scalability for network applications. It is capable of supporting multiple protocols, including Ethernet, Wi-Fi, and Bluetooth, as well as advanced communication protocols such as 5G and 6G. This chip model is also designed to be compatible with a wide range of devices, including smartphones, tablets, and computers.
The XC3195A-3PP175I chip model is also capable of being used in the era of fully intelligent systems. It is capable of supporting multiple intelligent scenarios, such as voice recognition, facial recognition, and automated decision making. This chip model is also capable of being used in the development of intelligent robots, as it provides the necessary tools for the robot to perform tasks autonomously.
To effectively use the XC3195A-3PP175I chip model, technical talents such as software engineers, electrical engineers, and computer scientists are needed. These professionals should have a good understanding of the chip model and its capabilities, as well as the ability to program the model to perform the desired tasks. Additionally, they should also have knowledge of the communication protocols used by the chip model and the various intelligent scenarios that can be implemented with it.
In conclusion, the XC3195A-3PP175I chip model is an ideal component for advanced communication systems and can be used in the era of fully intelligent systems. It is capable of supporting multiple protocols, intelligent scenarios, and can be used in the development of intelligent robots. To effectively use the XC3195A-3PP175I chip model, technical talents such as software engineers, electrical engineers, and computer scientists are needed.
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| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||