AMD Xilinx
XC3195A-3PP175C
XC3195A-3PP175C ECAD Model
XC3195A-3PP175C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 484 | |
| Number of Equivalent Gates | 6500 | |
| Number of CLBs | 484 | |
| Combinatorial Delay of a CLB-Max | 2.7 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 484 CLBS, 6500 GATES | |
| Additional Feature | MAX USABLE 7500 LOGIC GATES | |
| Clock Frequency-Max | 270 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PPGA-P175 | |
| Qualification Status | Not Qualified | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 175 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HPGA | |
| Package Equivalence Code | PGA175,16X16 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 4.191 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | HPGA, PGA175,16X16 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | PGA | |
| Pin Count | 175 |
XC3195A-3PP175C Datasheet Download
XC3195A-3PP175C Overview
The XC3195A-3PP175C chip model is a highly advanced and powerful integrated circuit developed by the world-renowned manufacturer Xilinx Inc. It is designed to meet the stringent requirements of modern communication systems and other related industries. This chip model has a wide range of features and benefits, making it a popular choice for many applications.
The XC3195A-3PP175C chip model is a high-performance, low-power device that is designed to meet the needs of modern communication systems and other related industries. It is capable of providing excellent signal reception and transmission capabilities, as well as providing low power consumption and a wide range of features. This chip model also has the ability to support a variety of communication protocols, including Bluetooth, Wi-Fi, and Zigbee, making it an ideal choice for many applications.
The XC3195A-3PP175C chip model is designed to meet the specific design requirements of modern communication systems and other related industries. It has a wide range of features and benefits, including a high-performance processor, integrated memory, and an advanced communication interface. This chip model also includes a range of additional features, such as advanced power management and a variety of security features, making it an ideal choice for many applications.
The XC3195A-3PP175C chip model is expected to experience high demand in the future as more applications require its advanced features and benefits. This chip model is also capable of being upgraded to meet the changing needs of modern communication systems, making it an ideal choice for many applications. Additionally, this chip model is designed to be compatible with a variety of communication protocols, making it an ideal choice for many applications.
When using the XC3195A-3PP175C chip model, there are a few important considerations to keep in mind. It is important to ensure that the chip model is properly installed and configured in order to ensure optimal performance. Additionally, it is important to ensure that the chip model is properly maintained in order to ensure long-term reliability and performance. Finally, it is important to ensure that the chip model is properly tested and verified in order to ensure that it meets the required standards.
In conclusion, the XC3195A-3PP175C chip model is an advanced and powerful integrated circuit developed by the world-renowned manufacturer Xilinx Inc. It is designed to meet the specific design requirements of modern communication systems and other related industries. This chip model has a wide range of features and benefits, making it a popular choice for many applications. It is also capable of being upgraded to meet the changing needs of modern communication systems, making it an ideal choice for many applications. Additionally, this chip model is designed to be compatible with a variety of communication protocols, making it an ideal choice for many applications. Finally, it is important to ensure that the chip model is properly installed, configured, maintained, tested, and verified in order to ensure optimal performance.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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