AMD Xilinx
XC3195A-2PP175I
XC3195A-2PP175I ECAD Model
XC3195A-2PP175I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 484 | |
| Number of Equivalent Gates | 6500 | |
| Number of CLBs | 484 | |
| Combinatorial Delay of a CLB-Max | 2.2 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 484 CLBS, 6500 GATES | |
| Additional Feature | MAX USABLE 7500 LOGIC GATES | |
| Clock Frequency-Max | 323 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-PPGA-P175 | |
| Qualification Status | Not Qualified | |
| Moisture Sensitivity Level | 1 | |
| Number of Terminals | 175 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HPGA | |
| Package Equivalence Code | PGA175,16X16 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 4.191 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | HPGA, PGA175,16X16 | |
| Pin Count | 175 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3195A-2PP175I Datasheet Download
XC3195A-2PP175I Overview
The chip model XC3195A-2PP175I is a powerful integrated circuit designed for high-performance digital signal processing, embedded processing, and image processing. It is designed with a high-speed and low-power architecture, making it an ideal choice for applications that require fast and reliable performance. The chip model is equipped with a high-level HDL language, which enables users to quickly and easily program the chip for a variety of applications.
The XC3195A-2PP175I chip has a number of advantages over other chips in the same class, such as a high-speed and low-power architecture, a comprehensive set of features, and a high-level HDL language. As a result, the chip model is becoming increasingly popular in the industry, and demand for it is expected to continue to rise in the future. Furthermore, the chip model is capable of handling a variety of tasks, making it suitable for a wide range of applications.
The original design intention of the chip model XC3195A-2PP175I was to provide users with an efficient and reliable solution for their digital signal processing, embedded processing, and image processing needs. The chip model is capable of handling a variety of tasks, making it suitable for a wide range of applications. Furthermore, the chip model is equipped with a high-level HDL language, which enables users to quickly and easily program the chip for a variety of applications.
In terms of future upgrades, the chip model XC3195A-2PP175I has the potential to be upgraded to support advanced communication systems. This could open up a number of new possibilities for the chip model, as it would enable it to handle a wider range of tasks and applications. Furthermore, the chip model is already capable of handling a variety of tasks, making it suitable for a wide range of applications.
In conclusion, the chip model XC3195A-2PP175I is an ideal choice for applications that require fast and reliable performance. It has a number of advantages over other chips in the same class, such as a high-speed and low-power architecture, a comprehensive set of features, and a high-level HDL language. Furthermore, the chip model is capable of handling a variety of tasks, making it suitable for a wide range of applications. Additionally, the chip model has the potential to be upgraded to support advanced communication systems, which could open up a number of new possibilities for the chip model.
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| QTY | Unit Price | Ext Price |
|---|---|---|
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