AMD Xilinx
XC3090A-7PG175I
XC3090A-7PG175I ECAD Model
XC3090A-7PG175I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 5.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | MAX USABLE 6000 LOGIC GATES | |
| Clock Frequency-Max | 113 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| JESD-30 Code | S-CPGA-P175 | |
| Qualification Status | Not Qualified | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 175 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | HPGA | |
| Package Equivalence Code | PGA175,16X16 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 4.318 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | HPGA, PGA175,16X16 | |
| Pin Count | 175 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3090A-7PG175I Datasheet Download
XC3090A-7PG175I Overview
The XC3090A-7PG175I chip model is an advanced technology that is suitable for a variety of applications. This model is particularly useful for high-performance digital signal processing, embedded processing, and image processing. It requires the use of HDL language, which is a hardware description language that allows for the creation of complex digital systems.
The future of the XC3090A-7PG175I chip model is highly dependent on the advancement of technology. With the rise of 5G networks and the increasing demand for intelligent systems, the chip model’s potential applications will expand. It could be used to create more intelligent networks and scenarios, as well as to power the fully intelligent systems of the future.
The chip model is already being used in a variety of industries and applications. It is used in the automotive industry for driver assistance systems, in the health care industry for medical imaging, and in the telecommunications industry for high-speed data processing. As technology advances, the possibilities for the XC3090A-7PG175I chip model are virtually limitless.
The XC3090A-7PG175I chip model is a powerful tool that can be used to create innovative solutions for a variety of industries. With the help of HDL language, the chip model can be used to create complex digital systems that can be used to solve real-world problems. As technology advances, the chip model will become even more useful and will be able to power the fully intelligent systems of the future.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||