AMD Xilinx
XC3090A-6PP175C
XC3090A-6PP175C ECAD Model
XC3090A-6PP175C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 4.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | MAX USABLE 6000 LOGIC GATES | |
| Clock Frequency-Max | 135 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-PPGA-P175 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 1 | |
| Operating Temperature-Max | 85 °C | |
| Number of Terminals | 175 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HPGA | |
| Package Equivalence Code | PGA175,16X16 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | NO | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 4.191 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | HPGA, PGA175,16X16 | |
| Pin Count | 175 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3090A-6PP175C Datasheet Download
XC3090A-6PP175C Overview
The chip model XC3090A-6PP175C is a highly advanced integrated circuit that has been designed to meet the ever-increasing demands of the modern communication systems. It is a powerful and reliable chip that provides excellent performance in both digital and analog systems. With its high-speed data processing capabilities, it is capable of handling large amounts of data with ease and accuracy.
The XC3090A-6PP175C chip model is designed to meet the challenging requirements of today's communication systems. It is an integrated circuit that combines a wide range of features, including high speed data processing, low power consumption, and high reliability. This chip model is designed to provide excellent performance in both digital and analog systems. It is designed to provide a high degree of flexibility and scalability, allowing it to be used in a wide range of applications.
The XC3090A-6PP175C chip model is expected to be in high demand in the future, as communication systems become increasingly complex and demanding. It is capable of handling large amounts of data quickly and accurately, making it ideal for use in the most advanced communication systems. It is also capable of providing excellent performance in both digital and analog systems, making it suitable for use in a wide range of applications.
The design of the XC3090A-6PP175C chip model was based on a number of specific design requirements. These requirements included high speed data processing, low power consumption, high reliability, and flexibility. The chip model was designed to provide excellent performance in both digital and analog systems, allowing it to be used in a wide range of applications.
The XC3090A-6PP175C chip model has been successfully used in a number of different applications. For example, it has been used in the development of advanced communication systems, such as the ones used in the aerospace and defense industries. It has also been used in the development of medical imaging systems, as well as in the development of digital signal processing systems.
The XC3090A-6PP175C chip model is capable of being upgraded in the future, allowing it to be used in the most advanced communication systems. However, it is important to note that the chip model is not suitable for use in all applications, and it is important to ensure that it is used in the correct application. It is also important to ensure that the chip model is used in accordance with the manufacturer's instructions and that all safety precautions are taken.
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3,018 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $46.8354 | $46.8354 |
| 10+ | $46.3318 | $463.3175 |
| 100+ | $43.8137 | $4,381.3722 |
| 1000+ | $41.2957 | $20,647.8460 |
| 10000+ | $37.7705 | $37,770.4500 |
| The price is for reference only, please refer to the actual quotation! | ||