AMD Xilinx
XC3090A-6PG175C
XC3090A-6PG175C ECAD Model
XC3090A-6PG175C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 5 V | |
| Number of Inputs | 144 | |
| Number of Outputs | 144 | |
| Number of Logic Cells | 320 | |
| Number of Equivalent Gates | 5000 | |
| Number of CLBs | 320 | |
| Combinatorial Delay of a CLB-Max | 4.1 ns | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 320 CLBS, 5000 GATES | |
| Additional Feature | MAX USABLE 6000 LOGIC GATES | |
| Clock Frequency-Max | 135 MHz | |
| Power Supplies | 5 V | |
| Supply Voltage-Max | 5.25 V | |
| Supply Voltage-Min | 4.75 V | |
| JESD-30 Code | S-CPGA-P175 | |
| Qualification Status | Not Qualified | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Number of Terminals | 175 | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | HPGA | |
| Package Equivalence Code | PGA175,16X16 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, HEAT SINK/SLUG | |
| Surface Mount | NO | |
| Terminal Form | PIN/PEG | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | PERPENDICULAR | |
| Width | 42.164 mm | |
| Length | 42.164 mm | |
| Seated Height-Max | 4.318 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | PGA | |
| Package Description | HPGA, PGA175,16X16 | |
| Pin Count | 175 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 |
XC3090A-6PG175C Datasheet Download
XC3090A-6PG175C Overview
The XC3090A-6PG175C chip model is a versatile and powerful component that has been designed to meet the requirements of a variety of industries. It is a low-power, high-performance device with a wide range of features, including a fast clock speed, high-level integration, and low power consumption. Its versatility makes it suitable for a variety of applications, from embedded systems to wireless communication.
The XC3090A-6PG175C chip model has several advantages over other chip models. Firstly, it is a low-power device, which means that it can be used in applications where power consumption is an issue. Secondly, it has a high level of integration, which allows it to be used in a variety of applications with minimal hardware requirements. Thirdly, it has a fast clock speed, which allows it to process data quickly and accurately. Finally, it has a low power consumption, which makes it an ideal choice for applications where power consumption is a concern.
The XC3090A-6PG175C chip model is expected to experience increasing demand in the near future. This is due to its versatility, low power consumption, and high level of integration. It is already being used in a variety of industries, such as automotive, medical, industrial, and consumer electronics. Furthermore, its fast clock speed makes it suitable for applications that require high data processing speeds, such as artificial intelligence and robotics.
The XC3090A-6PG175C chip model can be used for the development and popularization of future intelligent robots. It is a low-power, high-performance device, which makes it an ideal choice for robotic applications. Furthermore, its high level of integration allows it to be used in a variety of robotic applications, from navigation and motion control to object recognition and autonomous decision-making. However, in order to use the model effectively, technical talents such as software engineers and roboticists are needed.
In conclusion, the XC3090A-6PG175C chip model is a versatile and powerful component that is suitable for a variety of industries. Its advantages, such as low power consumption, fast clock speed, and high level of integration, make it an ideal choice for applications that require high data processing speeds. Furthermore, it is expected to experience increasing demand in the near future, and it can be used for the development and popularization of future intelligent robots. However, in order to use the model effectively, technical talents such as software engineers and roboticists are needed.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||