
AMD Xilinx
XC2VPX70-6FFG1704I
XC2VPX70-6FFG1704I ECAD Model
XC2VPX70-6FFG1704I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Not Recommended | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 992 | |
Number of Outputs | 992 | |
Number of Logic Cells | 74448 | |
Number of CLBs | 8272 | |
Combinatorial Delay of a CLB-Max | 320 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 8272 CLBS | |
Clock Frequency-Max | 1.2 GHz | |
Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B1704 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1704 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1704,42X42,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 3.45 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 42.50 X 42.50 MM, 1 MM PITCH, MS-034AAV-1, FCBGA-1704 | |
Pin Count | 1704 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC2VPX70-6FFG1704I Datasheet Download
XC2VPX70-6FFG1704I Overview
The XC2VPX70-6FFG1704I chip model is a powerful and versatile chip model designed for high-performance digital signal processing, embedded processing, and image processing. This chip model is an ideal choice for those who need to use HDL language for their projects. It offers a wide range of features and functions that make it an attractive choice for many applications.
The XC2VPX70-6FFG1704I chip model is equipped with advanced features such as a high-speed clock, high-performance memory, and a high-performance processor. It also offers a wide range of I/O options, including USB, Ethernet, and Serial interfaces. It has the capability to process multiple tasks simultaneously, making it an ideal choice for high-performance applications.
The XC2VPX70-6FFG1704I chip model offers a number of advantages, including its low power consumption, low cost, and high performance. It is also designed with a wide range of features, such as built-in debugging tools, high-speed clock, and a wide range of I/O options. This makes it an ideal choice for a wide range of applications, from simple to complex projects.
The XC2VPX70-6FFG1704I chip model is expected to be in high demand in the coming years. This is due to its ability to handle complex tasks, its low power consumption, and its low cost. Furthermore, its wide range of features and functions makes it an attractive choice for many applications.
The product description and specific design requirements of the XC2VPX70-6FFG1704I chip model should be carefully studied before using it in any application. It is important to understand the chip model's capabilities and limitations, as well as its design requirements. This will help ensure that the chip model is used in the most effective way and that it meets the requirements of the application.
In addition, actual case studies and precautions should be taken into consideration when using the XC2VPX70-6FFG1704I chip model. This will help to ensure that the chip model is used in the most efficient and effective manner. Furthermore, it is important to be aware of any potential risks associated with the chip model and to take the necessary steps to mitigate them.
Overall, the XC2VPX70-6FFG1704I chip model is an ideal choice for high-performance digital signal processing, embedded processing, and image processing. It offers a wide range of features and functions that make it an attractive choice for many applications. Furthermore, its low power consumption, low cost, and high performance make it an ideal choice for a wide range of applications. It is important to understand the product description and specific design requirements of the chip model, as well as actual case studies and precautions, before using it in any application.
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