XC2VPX70-6FFG1704I
XC2VPX70-6FFG1704I
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rohs

AMD Xilinx

XC2VPX70-6FFG1704I


XC2VPX70-6FFG1704I
F20-XC2VPX70-6FFG1704I
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 42.50 X 42.50 MM, 1 MM PITCH, MS-034AAV-1, FCBGA-1704
42.50 X 42.50 MM, 1 MM PITCH, MS-034AAV-1, FCBGA-1704

XC2VPX70-6FFG1704I ECAD Model


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XC2VPX70-6FFG1704I Attributes


Type Description Select
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Not Recommended
Supply Voltage-Nom 1.5 V
Number of Inputs 992
Number of Outputs 992
Number of Logic Cells 74448
Number of CLBs 8272
Combinatorial Delay of a CLB-Max 320 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Package Shape SQUARE
Technology CMOS
Organization 8272 CLBS
Clock Frequency-Max 1.2 GHz
Power Supplies 1.5,1.5/3.3,2/2.5,2.5 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B1704
Qualification Status Not Qualified
JESD-609 Code e1
Moisture Sensitivity Level 4
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1704
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1704,42X42,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 3.45 mm
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 42.50 X 42.50 MM, 1 MM PITCH, MS-034AAV-1, FCBGA-1704
Pin Count 1704
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01

XC2VPX70-6FFG1704I Datasheet Download


XC2VPX70-6FFG1704I Overview



The XC2VPX70-6FFG1704I chip model is a powerful and versatile chip model designed for high-performance digital signal processing, embedded processing, and image processing. This chip model is an ideal choice for those who need to use HDL language for their projects. It offers a wide range of features and functions that make it an attractive choice for many applications.


The XC2VPX70-6FFG1704I chip model is equipped with advanced features such as a high-speed clock, high-performance memory, and a high-performance processor. It also offers a wide range of I/O options, including USB, Ethernet, and Serial interfaces. It has the capability to process multiple tasks simultaneously, making it an ideal choice for high-performance applications.


The XC2VPX70-6FFG1704I chip model offers a number of advantages, including its low power consumption, low cost, and high performance. It is also designed with a wide range of features, such as built-in debugging tools, high-speed clock, and a wide range of I/O options. This makes it an ideal choice for a wide range of applications, from simple to complex projects.


The XC2VPX70-6FFG1704I chip model is expected to be in high demand in the coming years. This is due to its ability to handle complex tasks, its low power consumption, and its low cost. Furthermore, its wide range of features and functions makes it an attractive choice for many applications.


The product description and specific design requirements of the XC2VPX70-6FFG1704I chip model should be carefully studied before using it in any application. It is important to understand the chip model's capabilities and limitations, as well as its design requirements. This will help ensure that the chip model is used in the most effective way and that it meets the requirements of the application.


In addition, actual case studies and precautions should be taken into consideration when using the XC2VPX70-6FFG1704I chip model. This will help to ensure that the chip model is used in the most efficient and effective manner. Furthermore, it is important to be aware of any potential risks associated with the chip model and to take the necessary steps to mitigate them.


Overall, the XC2VPX70-6FFG1704I chip model is an ideal choice for high-performance digital signal processing, embedded processing, and image processing. It offers a wide range of features and functions that make it an attractive choice for many applications. Furthermore, its low power consumption, low cost, and high performance make it an ideal choice for a wide range of applications. It is important to understand the product description and specific design requirements of the chip model, as well as actual case studies and precautions, before using it in any application.



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