AMD Xilinx
XC2VPX70-6FFG1704C
XC2VPX70-6FFG1704C ECAD Model
XC2VPX70-6FFG1704C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Not Recommended | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 992 | |
| Number of Outputs | 992 | |
| Number of Logic Cells | 74448 | |
| Number of CLBs | 8272 | |
| Combinatorial Delay of a CLB-Max | 320 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 8272 CLBS | |
| Clock Frequency-Max | 1.2 GHz | |
| Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B1704 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 1704 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA1704,42X42,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Seated Height-Max | 3.45 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 42.50 X 42.50 MM, 1 MM PITCH, MS-034AAV-1, FCBGA-1704 | |
| Pin Count | 1704 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2VPX70-6FFG1704C Datasheet Download
XC2VPX70-6FFG1704C Overview
The XC2VPX70-6FFG1704C chip model is a powerful digital signal processor that has been designed to provide high-performance computing capabilities for embedded processing, image processing, and other applications. It is capable of processing large amounts of data quickly and accurately, making it an ideal choice for use in areas such as machine learning, artificial intelligence, and other data-intensive applications.
The XC2VPX70-6FFG1704C chip model is programmed using the HDL language, which is a high-level programming language designed for the development of digital systems. The HDL language provides a powerful toolset that allows developers to quickly and easily develop complex digital systems. This makes the XC2VPX70-6FFG1704C chip model an ideal choice for use in a wide variety of applications.
In terms of the future development of the XC2VPX70-6FFG1704C chip model, it is likely that the chip will be used in a wide variety of applications in the near future. As technology advances, the chip model is likely to be used in more and more applications, such as networks and intelligent systems. In addition, the chip model may be used in the era of fully intelligent systems, as it is capable of processing large amounts of data quickly and accurately.
The XC2VPX70-6FFG1704C chip model is a powerful and reliable processor that is suitable for a wide range of applications. It is capable of providing high-performance computing capabilities for embedded processing, image processing, and other applications, making it an ideal choice for use in areas such as machine learning, artificial intelligence, and other data-intensive applications. With the advancement of technology, the XC2VPX70-6FFG1704C chip model is likely to be used in more and more applications in the future, making it an invaluable tool for developers and engineers.
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