XC2VPX70-5FF1704C
XC2VPX70-5FF1704C
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AMD Xilinx

XC2VPX70-5FF1704C

XC2VPX70-5FF1704C
AMD Xilinx
F20-XC2VPX70-5FF1704C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 42.50 X 42.50 MM, 1 MM PITCH, MS-034AAV-1, FCBGA-1704
42.50 X 42.50 MM, 1 MM PITCH, MS-034AAV-1, FCBGA-1704
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XC2VPX70-5FF1704C Datasheet (PDF)
XC2VPX70-5FF1704C Document (PDF)

XC2VPX70-5FF1704C ECAD Model

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XC2VPX70-5FF1704C Attributes

Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Not Recommended
Supply Voltage-Nom 1.5 V
Number of Inputs 992
Number of Outputs 992
Number of Logic Cells 74448
Number of CLBs 8272
Combinatorial Delay of a CLB-Max 360 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 8272 CLBS
Clock Frequency-Max 1.05 GHz
Power Supplies 1.5,1.5/3.3,2/2.5,2.5 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B1704
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1704
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1704,42X42,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 3.45 mm
Ihs Manufacturer XILINX INC
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
Part Package Code BGA
Package Description 42.50 X 42.50 MM, 1 MM PITCH, MS-034AAV-1, FCBGA-1704
Pin Count 1704

XC2VPX70-5FF1704C Datasheet Download

XC2VPX70-5FF1704C Overview


The XC2VPX70-5FF1704C is a powerful chip model that has been designed to meet the demands of modern and future networks and intelligent systems. This model is a versatile, low-power, high-performance FPGA that offers a wide range of features and benefits.


The XC2VPX70-5FF1704C chip model is designed to provide a high degree of flexibility and scalability, allowing it to be used in a variety of applications. It is ideal for applications that require a high degree of customization, such as network security and storage systems. The chip model is also suitable for applications that require high levels of performance, such as artificial intelligence and machine learning.


The XC2VPX70-5FF1704C chip model is designed to be used in a variety of network and intelligent scenarios. It is capable of supporting multiple network protocols, including Ethernet, Wi-Fi, and LTE. It can also be used in a range of intelligent scenarios, such as robotics, autonomous vehicles, and virtual reality.


The XC2VPX70-5FF1704C chip model has a variety of design requirements that must be met in order to ensure optimal performance. It must be able to support a wide range of data rates, including both high-speed and low-speed networks. It must also be able to support a range of protocols, including Ethernet, Wi-Fi, and LTE. Additionally, the chip model must be able to support a variety of intelligent scenarios, such as robotics, autonomous vehicles, and virtual reality.


The XC2VPX70-5FF1704C chip model has a number of advantages that make it an attractive choice for a variety of applications. It is a low-power, high-performance FPGA that offers a wide range of features and benefits. It is also highly customizable, allowing it to be used in a variety of applications. Additionally, it is capable of supporting multiple network protocols, including Ethernet, Wi-Fi, and LTE.


The XC2VPX70-5FF1704C chip model is expected to be in high demand in the near future. It is ideal for applications that require a high degree of customization, such as network security and storage systems. It is also suitable for applications that require high levels of performance, such as artificial intelligence and machine learning. Additionally, it is capable of supporting a variety of intelligent scenarios, such as robotics, autonomous vehicles, and virtual reality.


When using the XC2VPX70-5FF1704C chip model, it is important to ensure that all design requirements are met in order to ensure optimal performance. It is also important to consider the potential applications of the chip model in the future, as well as the potential risks associated with using the chip model. Additionally, it is important to consider the specific design requirements of the chip model, as well as any actual case studies that may be available.



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Parts Index

XC2VPX70-5FF1704
2
XC2VPX70-5FF
4
XC2VPX70-5
4
XC2VPX70-
14
XC2VPX70
14
XC2VPX
29
XC2
4121
XC
65616