XC2VPX70-6FF1704C
XC2VPX70-6FF1704C
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rohs

AMD Xilinx

XC2VPX70-6FF1704C


XC2VPX70-6FF1704C
F20-XC2VPX70-6FF1704C
Active
FIELD PROGRAMMABLE GATE ARRAY, CMOS, 42.50 X 42.50 MM, 1 MM PITCH, MS-034AAV-1, FCBGA-1704
42.50 X 42.50 MM, 1 MM PITCH, MS-034AAV-1, FCBGA-1704

XC2VPX70-6FF1704C ECAD Model


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XC2VPX70-6FF1704C Attributes


Type Description Select
Pbfree Code No
Rohs Code No
Part Life Cycle Code Not Recommended
Supply Voltage-Nom 1.5 V
Number of Inputs 992
Number of Outputs 992
Number of Logic Cells 74448
Number of CLBs 8272
Combinatorial Delay of a CLB-Max 320 ps
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Temperature Grade OTHER
Package Shape SQUARE
Technology CMOS
Organization 8272 CLBS
Clock Frequency-Max 1.2 GHz
Power Supplies 1.5,1.5/3.3,2/2.5,2.5 V
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
JESD-30 Code S-PBGA-B1704
Qualification Status Not Qualified
JESD-609 Code e0
Moisture Sensitivity Level 4
Operating Temperature-Max 85 °C
Peak Reflow Temperature (Cel) 225
Time@Peak Reflow Temperature-Max (s) 30
Number of Terminals 1704
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1704,42X42,40
Package Shape SQUARE
Package Style GRID ARRAY
Surface Mount YES
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 42.5 mm
Length 42.5 mm
Seated Height-Max 3.45 mm
Ihs Manufacturer XILINX INC
Package Description 42.50 X 42.50 MM, 1 MM PITCH, MS-034AAV-1, FCBGA-1704
Reach Compliance Code not_compliant
HTS Code 8542.39.00.01
Part Package Code BGA
Pin Count 1704

XC2VPX70-6FF1704C Datasheet Download


XC2VPX70-6FF1704C Overview



The XC2VPX70-6FF1704C chip model is a powerful and versatile model that is suitable for a wide range of applications, from high-performance digital signal processing to embedded processing and image processing. It is designed to be used with the HDL (Hardware Description Language) language, which allows for the creation of complex logic designs that can be used in a variety of applications.


The potential applications of the XC2VPX70-6FF1704C chip model in the future are vast. It can be used in network applications, such as data transmission and storage, as well as in intelligent scenarios such as natural language processing and machine learning. With its powerful processing capabilities, it can be used to create fully intelligent systems capable of making decisions and learning from their environment.


The XC2VPX70-6FF1704C chip model is also suitable for the development and popularization of future intelligent robots. It can be used to create robots that are able to perceive and interact with their environment, as well as to develop robots that are able to perform complex tasks autonomously. To use the XC2VPX70-6FF1704C chip model effectively, it is necessary to have a good understanding of the HDL language and the capabilities of the model. Additionally, knowledge of robotics and artificial intelligence can be beneficial when developing robots using the XC2VPX70-6FF1704C chip model.



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