
AMD Xilinx
XC2VPX70-6FF1704C
XC2VPX70-6FF1704C ECAD Model
XC2VPX70-6FF1704C Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Not Recommended | |
Supply Voltage-Nom | 1.5 V | |
Number of Inputs | 992 | |
Number of Outputs | 992 | |
Number of Logic Cells | 74448 | |
Number of CLBs | 8272 | |
Combinatorial Delay of a CLB-Max | 320 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Temperature Grade | OTHER | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 8272 CLBS | |
Clock Frequency-Max | 1.2 GHz | |
Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B1704 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 4 | |
Operating Temperature-Max | 85 °C | |
Peak Reflow Temperature (Cel) | 225 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 1704 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA1704,42X42,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 42.5 mm | |
Length | 42.5 mm | |
Seated Height-Max | 3.45 mm | |
Ihs Manufacturer | XILINX INC | |
Package Description | 42.50 X 42.50 MM, 1 MM PITCH, MS-034AAV-1, FCBGA-1704 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
Part Package Code | BGA | |
Pin Count | 1704 |
XC2VPX70-6FF1704C Datasheet Download
XC2VPX70-6FF1704C Overview
The XC2VPX70-6FF1704C chip model is a powerful and versatile model that is suitable for a wide range of applications, from high-performance digital signal processing to embedded processing and image processing. It is designed to be used with the HDL (Hardware Description Language) language, which allows for the creation of complex logic designs that can be used in a variety of applications.
The potential applications of the XC2VPX70-6FF1704C chip model in the future are vast. It can be used in network applications, such as data transmission and storage, as well as in intelligent scenarios such as natural language processing and machine learning. With its powerful processing capabilities, it can be used to create fully intelligent systems capable of making decisions and learning from their environment.
The XC2VPX70-6FF1704C chip model is also suitable for the development and popularization of future intelligent robots. It can be used to create robots that are able to perceive and interact with their environment, as well as to develop robots that are able to perform complex tasks autonomously. To use the XC2VPX70-6FF1704C chip model effectively, it is necessary to have a good understanding of the HDL language and the capabilities of the model. Additionally, knowledge of robotics and artificial intelligence can be beneficial when developing robots using the XC2VPX70-6FF1704C chip model.
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