AMD Xilinx
XC2VPX20-6FFG896I
XC2VPX20-6FFG896I ECAD Model
XC2VPX20-6FFG896I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 552 | |
| Number of Outputs | 552 | |
| Number of Logic Cells | 22032 | |
| Number of CLBs | 2448 | |
| Combinatorial Delay of a CLB-Max | 320 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2448 CLBS | |
| Clock Frequency-Max | 1.2 GHz | |
| Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B896 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 896 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA896,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 31 X 31 MM, 1 MM PITCH, MS-034AAN-1, FCBGA-896 | |
| Pin Count | 896 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2VPX20-6FFG896I Datasheet Download
XC2VPX20-6FFG896I Overview
The XC2VPX20-6FFG896I chip model is an advanced integrated circuit (IC) designed to meet the needs of modern high-performance applications. This chip is a Virtex-II Pro field-programmable gate array (FPGA) with a 6 million gate capacity. It has several advantages that make it attractive for industries that need high-performance computing power.
The XC2VPX20-6FFG896I chip model is designed to provide high-speed operation, low power consumption, and high reliability. It has a large number of I/Os, allowing for a wide range of applications. It also supports multiple clock domains, which makes it suitable for applications that require multiple clock frequencies. Additionally, the chip model has built-in memory, which can be used to store data and instructions.
The XC2VPX20-6FFG896I chip model is expected to have increasing demand in the future, as its advantages make it suitable for a variety of applications. It can be used in communication systems, industrial automation, medical imaging, and other areas. It is also expected to be used in the development and popularization of intelligent robots, as its features make it a good choice for robotics applications.
The original design intention of the XC2VPX20-6FFG896I chip model was to provide a reliable, high-performance solution for a range of applications. The chip model can be upgraded in the future to meet the demands of newer applications. It can also be used in advanced communication systems, as it has the necessary features to be used in such systems.
The XC2VPX20-6FFG896I chip model can be used in the development and popularization of intelligent robots. Its features make it a good choice for robotics applications, as it can provide the necessary processing power and memory for such applications. Technical talents are needed to effectively use the model, such as engineers with knowledge of FPGA programming and robotics development.
In conclusion, the XC2VPX20-6FFG896I chip model is an advanced integrated circuit designed to meet the needs of modern high-performance applications. It has several advantages that make it attractive for industries that need high-performance computing power. It is expected to have increasing demand in the future, as its features make it suitable for a variety of applications. It can also be used in the development and popularization of intelligent robots, with the help of technical talents. The chip model can be upgraded in the future to meet the demands of newer applications.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||