AMD Xilinx
XC2VPX20-6FF896C
XC2VPX20-6FF896C ECAD Model
XC2VPX20-6FF896C Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 552 | |
| Number of Outputs | 552 | |
| Number of Logic Cells | 22032 | |
| Number of CLBs | 2448 | |
| Combinatorial Delay of a CLB-Max | 320 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | OTHER | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2448 CLBS | |
| Clock Frequency-Max | 1.2 GHz | |
| Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B896 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 896 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA896,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 31 X 31 MM, 1 MM PITCH, MS-034AAN-1, FCBGA-896 | |
| Pin Count | 896 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2VPX20-6FF896C Datasheet Download
XC2VPX20-6FF896C Overview
The XC2VPX20-6FF896C is a high-performance chip model designed for digital signal processing, embedded processing, and image processing. It requires the use of HDL language for programming and requires specific design requirements for its application environment. This chip model is ideal for industries that require high-performance computing such as data centers, medical imaging, and autonomous driving.
The XC2VPX20-6FF896C is a powerful chip model that is capable of processing large amounts of data quickly and accurately. It features a 6-layer FPGA architecture and includes a variety of features such as high-speed memory, high-speed logic, and high-speed I/O. Its design also allows for the use of multiple processors, making it suitable for parallel computing tasks.
The XC2VPX20-6FF896C is designed for use in high-performance applications such as data centers, medical imaging, and autonomous driving. It is capable of processing large amounts of data quickly and accurately. With its 6-layer FPGA architecture, it is able to handle complex tasks such as image processing and embedded processing. It is also able to support multiple processors, allowing for parallel computing tasks.
The XC2VPX20-6FF896C is designed for use in a variety of industries and applications. It is ideal for high-performance digital signal processing, embedded processing, and image processing. It is also suitable for data centers, medical imaging, and autonomous driving. In addition, it can be used for applications requiring high-speed memory, high-speed logic, and high-speed I/O.
The XC2VPX20-6FF896C is a powerful chip model that is ideal for a variety of industries and applications. It is designed to be used in high-performance applications such as data centers, medical imaging, and autonomous driving. It is capable of processing large amounts of data quickly and accurately and supports multiple processors for parallel computing tasks. In addition, it is suitable for applications requiring high-speed memory, high-speed logic, and high-speed I/O.
When using the XC2VPX20-6FF896C, it is important to consider the specific design requirements for the application environment. It is also important to consider the industry trends of the chip model and the future development of related industries. This will help ensure that the application environment is suitable for the chip model and that it is able to support the necessary technologies.
In conclusion, the XC2VPX20-6FF896C is a powerful chip model that is ideal for a variety of industries and applications. It is designed for use in high-performance applications such as data centers, medical imaging, and autonomous driving. It is capable of processing large amounts of data quickly and accurately and supports multiple processors for parallel computing tasks. When using this chip model, it is important to consider the specific design requirements for the application environment, as well as the industry trends and future development of related industries. This will help ensure that the application environment is suitable for the chip model and that it is able to support the necessary technologies.
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2,178 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $87.0480 | $87.0480 |
| 10+ | $86.1120 | $861.1200 |
| 100+ | $81.4320 | $8,143.2000 |
| 1000+ | $76.7520 | $38,376.0000 |
| 10000+ | $70.2000 | $70,200.0000 |
| The price is for reference only, please refer to the actual quotation! | ||