AMD Xilinx
XC2VPX20-5FF896I
XC2VPX20-5FF896I ECAD Model
XC2VPX20-5FF896I Attributes
| Type | Description | Select |
|---|---|---|
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 552 | |
| Number of Outputs | 552 | |
| Number of Logic Cells | 22032 | |
| Number of CLBs | 2448 | |
| Combinatorial Delay of a CLB-Max | 360 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 2448 CLBS | |
| Clock Frequency-Max | 1.05 GHz | |
| Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B896 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 896 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA896,30X30,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 31 mm | |
| Length | 31 mm | |
| Seated Height-Max | 3.4 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 31 X 31 MM, 1 MM PITCH, MS-034AAN-1, FCBGA-896 | |
| Pin Count | 896 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2VPX20-5FF896I Datasheet Download
XC2VPX20-5FF896I Overview
The Xilinx XC2VPX20-5FF896I chip model is a highly efficient, low-cost, and highly reliable integrated circuit that is designed to be used in a variety of different applications. It is a powerful, versatile, and highly efficient integrated circuit that is capable of handling a wide range of tasks and functions. It is an excellent choice for a variety of applications, including embedded systems, communications, networking, and industrial automation.
The XC2VPX20-5FF896I chip model has many advantages, including low power consumption, high performance, and a wide range of features. It is designed with a high level of scalability and flexibility, allowing it to be used in a variety of different applications. It is also designed with a high level of integration, allowing it to be used in a variety of different systems.
The XC2VPX20-5FF896I chip model is expected to be in high demand in the future as the demand for more advanced and efficient integrated circuits continues to grow. As the demand for more advanced and efficient integrated circuits continues to grow, the XC2VPX20-5FF896I chip model will be able to meet the needs of a variety of different applications. This chip model is expected to be used in a variety of different applications in the future, including embedded systems, communications, networking, and industrial automation.
The original design intention of the XC2VPX20-5FF896I chip model was to provide a powerful, versatile, and highly efficient integrated circuit that is capable of handling a wide range of tasks and functions. The chip model is designed to be highly flexible and scalable, allowing it to be used in a variety of different applications. It is also designed with a high level of integration, allowing it to be used in a variety of different systems.
The XC2VPX20-5FF896I chip model is also designed with the possibility of future upgrades, allowing it to be used in more advanced applications. It is possible that the chip model could be used in advanced communication systems, such as 5G and beyond. It is also possible that the chip model could be used in networks and in intelligent scenarios, such as autonomous vehicles and smart cities.
The XC2VPX20-5FF896I chip model is an excellent choice for a variety of applications, and it is expected to be in high demand in the future. It is designed with a high level of scalability and flexibility, allowing it to be used in a variety of different applications. It is also designed with the possibility of future upgrades, allowing it to be used in more advanced applications. It is possible that the chip model could be used in advanced communication systems, networks, and intelligent scenarios, such as autonomous vehicles and smart cities. This chip model is an excellent choice for a variety of applications and is expected to be used in the era of fully intelligent systems.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||