AMD Xilinx
XC2VP7-7FFG672I
XC2VP7-7FFG672I ECAD Model
XC2VP7-7FFG672I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of CLBs | 1232 | |
| Combinatorial Delay of a CLB-Max | 280 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 1232 CLBS | |
| Clock Frequency-Max | 1.35 GHz | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.65 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 1 MM PITCH, FLIP CHIP, FBGA-672 | |
| Pin Count | 672 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2VP7-7FFG672I Datasheet Download
XC2VP7-7FFG672I Overview
The chip model XC2VP7-7FFG672I is a powerful tool for digital signal processing, embedded processing, and image processing. It is designed to be used with the HDL language and is capable of performing complex tasks quickly and efficiently. This chip model can be used in a variety of applications, including network applications, intelligent scenarios, and even the development and popularization of future intelligent robots.
In terms of network applications, the XC2VP7-7FFG672I chip model can be used to create highly efficient networks with optimized performance. It can be used to build complex, high-speed connections between multiple devices, making it ideal for applications such as high-speed data transmission and real-time communication. Furthermore, it can be used to create intelligent networks that are capable of learning and adapting to changing conditions.
In terms of intelligent scenarios, the XC2VP7-7FFG672I chip model can be used to create intelligent systems that are capable of learning and making decisions. It can be used to develop intelligent robots that are able to interact with their environment and make decisions based on their observations. It can also be used to create autonomous systems that are capable of making decisions without human intervention.
Finally, in terms of the development and popularization of future intelligent robots, the XC2VP7-7FFG672I chip model can be used to create robots that are able to interact with their environment and make decisions based on their observations. It can also be used to develop robots that are able to move autonomously and make decisions based on their observations.
To effectively use the XC2VP7-7FFG672I chip model, there are a few technical talents that are needed. These include knowledge of HDL language, knowledge of digital signal processing, embedded processing, and image processing, as well as knowledge of networks and intelligent systems. Furthermore, knowledge of robotics and artificial intelligence is also necessary to effectively use the model. With these skills, the XC2VP7-7FFG672I chip model can be used to create powerful and efficient networks, intelligent systems, and robots.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||