
AMD Xilinx
XC2VP2-7FFG672I
XC2VP2-7FFG672I ECAD Model
XC2VP2-7FFG672I Attributes
Type | Description | Select |
---|---|---|
Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Supply Voltage-Nom | 1.5 V | |
Number of CLBs | 352 | |
Combinatorial Delay of a CLB-Max | 280 ps | |
Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
Package Shape | SQUARE | |
Technology | CMOS | |
Organization | 352 CLBS | |
Clock Frequency-Max | 1.35 GHz | |
Supply Voltage-Max | 1.575 V | |
Supply Voltage-Min | 1.425 V | |
JESD-30 Code | S-PBGA-B672 | |
Qualification Status | Not Qualified | |
JESD-609 Code | e1 | |
Moisture Sensitivity Level | 4 | |
Peak Reflow Temperature (Cel) | 245 | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Number of Terminals | 672 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Surface Mount | YES | |
Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Width | 27 mm | |
Length | 27 mm | |
Seated Height-Max | 2.65 mm | |
Ihs Manufacturer | XILINX INC | |
Part Package Code | BGA | |
Package Description | 1 MM PITCH, FLIP CHIP, FBGA-672 | |
Pin Count | 672 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 |
XC2VP2-7FFG672I Datasheet Download
XC2VP2-7FFG672I Overview
The Xilinx XC2VP2-7FFG672I chip model is a highly advanced and versatile programmable logic device (PLD) that is suitable for a range of applications, from high-performance digital signal processing to embedded processing and image processing. It is designed to be programmed using HDL (hardware description language) and provides a range of features that make it an attractive choice for many applications.
The original design intention of the XC2VP2-7FFG672I was to provide a highly flexible and powerful platform for a variety of applications, and the design team have done a great job of creating a chip that is capable of handling a wide range of tasks. The chip is capable of being upgraded and expanded to meet the needs of future applications, and this makes it an ideal choice for use in advanced communication systems.
The XC2VP2-7FFG672I chip model is also well-suited for use in networked systems, as it is capable of handling complex data processing tasks. It is also capable of being used in intelligent scenarios, such as artificial intelligence, machine learning, and natural language processing. With the increasing demand for intelligent systems in the era of fully intelligent systems, the XC2VP2-7FFG672I chip model is an ideal choice for use in such applications.
In conclusion, the Xilinx XC2VP2-7FFG672I chip model is an advanced, versatile, and powerful programmable logic device that is suitable for a range of applications, from high-performance digital signal processing to embedded processing and image processing. It is designed to be programmed using HDL and is capable of being upgraded and expanded to meet the needs of future applications. It is also well-suited for use in networked systems and intelligent scenarios, making it an ideal choice for use in the era of fully intelligent systems.
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