AMD Xilinx
XC2VP4-7FFG672I
XC2VP4-7FFG672I ECAD Model
XC2VP4-7FFG672I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of CLBs | 752 | |
| Combinatorial Delay of a CLB-Max | 280 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 752 CLBS | |
| Clock Frequency-Max | 1.35 GHz | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e1 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 245 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.65 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | 1 MM PITCH, FLIP CHIP, FBGA-672 | |
| Pin Count | 672 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2VP4-7FFG672I Datasheet Download
XC2VP4-7FFG672I Overview
The XC2VP4-7FFG672I chip model is a high-performance, low-power, and cost-effective FPGA. It is designed to meet the demands of a wide range of industries and applications, from broadcast video to aerospace and defense. This chip model is capable of providing high-speed data transmission, low-power consumption, and reliable data storage.
The XC2VP4-7FFG672I chip model is equipped with two high-speed transceivers, two high-performance memory controllers, and two low-power embedded processors. It has a total of 7,672 logic cells, 4,096 RAM blocks, and 1,024 DSP slices. The device also includes a high-speed, low-power, and reliable DDR3 interface, making it suitable for a variety of applications.
The XC2VP4-7FFG672I chip model is designed to meet the demands of the most advanced communication systems. It features the latest FPGA technology, making it suitable for high-speed data transmission, low-power consumption, and reliable data storage. The device also supports advanced features such as high-speed transceivers, high-performance memory controllers, and low-power embedded processors.
The XC2VP4-7FFG672I chip model is expected to be in high demand in the future. Its low-power consumption, high-speed data transmission, and reliable data storage capabilities make it ideal for a variety of applications. It can be used in a variety of industries, including broadcast video, aerospace, and defense.
The XC2VP4-7FFG672I chip model is designed with the latest FPGA technology to meet the demands of the most advanced communication systems. It is capable of providing high-speed data transmission, low-power consumption, and reliable data storage. The device also supports advanced features such as high-speed transceivers, high-performance memory controllers, and low-power embedded processors.
When designing the XC2VP4-7FFG672I chip model, it is important to consider the specific design requirements of the application. For example, if the application requires high-speed data transmission, then the device should be equipped with two high-speed transceivers. If the application requires low-power consumption, then the device should be equipped with two low-power embedded processors.
The XC2VP4-7FFG672I chip model can be upgraded in the future if necessary. For example, if the application requires more memory or faster data transmission, then the device can be upgraded to include more RAM blocks or higher-speed transceivers. It is also possible to upgrade the device to include advanced features such as high-speed transceivers, high-performance memory controllers, and low-power embedded processors.
When using the XC2VP4-7FFG672I chip model, it is important to consider the actual case studies and precautions. For example, if the application requires a reliable data storage solution, then the device should be tested for reliability and durability before being deployed in the field. It is also important to ensure that the device is compatible with the application's hardware and software before deployment.
In conclusion, the XC2VP4-7FFG672I chip model is a high-performance, low-power, and cost-effective FPGA. It is designed to meet the demands of a wide range of industries and applications, from broadcast video to aerospace and defense. The device is expected to be in high demand in the future, and it can be upgraded if necessary. When using the XC2VP4-7FFG672I chip model, it is important to consider the specific design requirements of the application, as well as the actual case studies and precautions.
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Pricing (USD)
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|---|---|---|
| No reference price found. | ||