AMD Xilinx
XC2VP2-7FF672I
XC2VP2-7FF672I ECAD Model
XC2VP2-7FF672I Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.5 V | |
| Number of Inputs | 204 | |
| Number of Outputs | 204 | |
| Number of Logic Cells | 3168 | |
| Number of CLBs | 352 | |
| Combinatorial Delay of a CLB-Max | 280 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 352 CLBS | |
| Clock Frequency-Max | 1.35 GHz | |
| Power Supplies | 1.5,1.5/3.3,2/2.5,2.5 V | |
| Supply Voltage-Max | 1.575 V | |
| Supply Voltage-Min | 1.425 V | |
| JESD-30 Code | S-PBGA-B672 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 4 | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 672 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA672,26X26,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 27 mm | |
| Length | 27 mm | |
| Seated Height-Max | 2.65 mm | |
| Ihs Manufacturer | XILINX INC | |
| Package Description | 1 MM PITCH, FLIP CHIP, FBGA-672 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Part Package Code | BGA | |
| Pin Count | 672 |
XC2VP2-7FF672I Datasheet Download
XC2VP2-7FF672I Overview
The XC2VP2-7FF672I chip model is a powerful tool that can be used to develop a variety of applications in the field of networks and other related industries. This model is a versatile, low-power, high-speed FPGA device that is capable of providing high-performance solutions for a wide range of applications. It is equipped with a variety of features that make it suitable for a wide range of applications, including high-speed networking, high-speed data processing, and high-performance computing.
The XC2VP2-7FF672I chip model is expected to experience a growing demand in the future due to its versatility and the wide range of applications it can be used for. This chip model is able to provide a high-speed, low-power solution for a variety of applications, including high-speed networking, data processing, and high-performance computing. In addition, this model is also capable of providing a wide range of intelligent solutions, such as intelligent automation, intelligent control, and intelligent monitoring.
The XC2VP2-7FF672I chip model is expected to be used in a variety of intelligent scenarios in the future. This model is capable of providing a powerful and efficient solution for intelligent automation, intelligent control, and intelligent monitoring. In addition, this model is also capable of providing a wide range of intelligent solutions for various applications, including intelligent robots. As such, this model is expected to be used in the development and popularization of future intelligent robots.
In order to use the XC2VP2-7FF672I chip model effectively, it is important to have the necessary technical skills and knowledge. This model requires a deep understanding of the underlying hardware and software architecture and the ability to program and debug the device. In addition, it is also important to have a good understanding of the various algorithms and techniques used in the development of intelligent robots. Having the necessary technical skills and knowledge will ensure that the chip model is used effectively and efficiently in the development and popularization of future intelligent robots.
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Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||