AMD Xilinx
XC2S50E-7FT256C
XC2S50E-7FT256C ECAD Model
XC2S50E-7FT256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 182 | |
| Number of Outputs | 182 | |
| Number of Logic Cells | 1728 | |
| Number of Equivalent Gates | 23000 | |
| Number of CLBs | 384 | |
| Combinatorial Delay of a CLB-Max | 420 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 23000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 50000 | |
| Clock Frequency-Max | 400 MHz | |
| Power Supplies | 1.5/3.3,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XC2S50E-7FT256C Datasheet Download
XC2S50E-7FT256C Overview
The XC2S50E-7FT256C chip model is a high-performance digital signal processor designed to meet the needs of embedded processing, image processing and other high-performance applications. It is programmed using HDL language, which allows for the development of complex algorithms and applications.
The XC2S50E-7FT256C is a versatile chip that can be used in a variety of applications. It is well suited for applications in the fields of digital signal processing, embedded processing, image processing, and more. With its powerful capabilities, the XC2S50E-7FT256C chip model is the perfect choice for applications that require high performance and reliability.
The industry trends for the chip model XC2S50E-7FT256C and the related industries are constantly changing. As technologies and applications evolve, new technologies are required to meet the needs of the application environment. In order to stay up-to-date, the XC2S50E-7FT256C chip model must be able to support the latest technologies.
The XC2S50E-7FT256C chip model is capable of being used in network applications, as well as in intelligent scenarios. This chip model has the potential to be used in the era of fully intelligent systems, as it is able to process data quickly and accurately. It is also capable of being used in applications such as machine learning and artificial intelligence.
The XC2S50E-7FT256C chip model is an ideal choice for applications that require high performance and reliability. With its versatile capabilities, it can be used in a variety of applications, from digital signal processing to embedded processing and image processing. As technology and applications continue to evolve, the XC2S50E-7FT256C chip model is capable of supporting the latest technologies and can be used in the era of fully intelligent systems.
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2,581 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| 1+ | $20.6981 | $20.6981 |
| 10+ | $20.4755 | $204.7552 |
| 100+ | $19.3627 | $1,936.2720 |
| 1000+ | $18.2499 | $9,124.9600 |
| 10000+ | $16.6920 | $16,692.0000 |
| The price is for reference only, please refer to the actual quotation! | ||