AMD Xilinx
XC2S50-5FG256Q
XC2S50-5FG256Q ECAD Model
XC2S50-5FG256Q Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 2.5 V | |
| Number of Inputs | 180 | |
| Number of Outputs | 176 | |
| Number of Logic Cells | 1728 | |
| Number of Equivalent Gates | 50000 | |
| Number of CLBs | 384 | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | AUTOMOTIVE | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 384 CLBS, 50000 GATES | |
| Clock Frequency-Max | 263 MHz | |
| Power Supplies | 1.5/3.3,2.5 V | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Peak Reflow Temperature (Cel) | 225 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 |
XC2S50-5FG256Q Datasheet Download
XC2S50-5FG256Q Overview
The XC2S50-5FG256Q chip model is a powerful and versatile device that can be used in a variety of applications. It is designed to be used in high-performance digital signal processing, embedded processing, image processing, and other related applications. The chip model requires the use of HDL language in order to be effectively utilized.
The original design intention of the XC2S50-5FG256Q chip model is to provide a platform for users to create high-performance digital signal processing systems. The chip model is capable of being upgraded in the future with the addition of new features and capabilities. This makes it a great choice for users who are looking to create advanced communication systems.
The XC2S50-5FG256Q chip model can also be used in the development and popularization of future intelligent robots. This chip model has the necessary capabilities to enable the creation of complex robotic systems. In order to use the chip model effectively, users must have a strong understanding of HDL language and robotics technology.
Overall, the XC2S50-5FG256Q chip model is a powerful and versatile device that can be used in a variety of applications. Its original design intention and ability to be upgraded in the future make it a great choice for users who are looking to create advanced communication systems or develop and popularize future intelligent robots. In order to use the chip model effectively, users must have a strong understanding of HDL language and robotics technology.
You May Also Be Interested In
1,437 In Stock
Pricing (USD)
| QTY | Unit Price | Ext Price |
|---|---|---|
| No reference price found. | ||