AMD Xilinx
XC2S400E-7FT256C
XC2S400E-7FT256C ECAD Model
XC2S400E-7FT256C Attributes
| Type | Description | Select |
|---|---|---|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Supply Voltage-Nom | 1.8 V | |
| Number of Inputs | 410 | |
| Number of Outputs | 410 | |
| Number of Logic Cells | 10800 | |
| Number of Equivalent Gates | 52000 | |
| Number of CLBs | 864 | |
| Combinatorial Delay of a CLB-Max | 470 ps | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Package Shape | SQUARE | |
| Technology | CMOS | |
| Organization | 864 CLBS, 52000 GATES | |
| Additional Feature | MAXIMUM USABLE GATES = 150000 | |
| Clock Frequency-Max | 357 MHz | |
| Power Supplies | 1.2/3.6,1.8 V | |
| Supply Voltage-Max | 1.89 V | |
| Supply Voltage-Min | 1.71 V | |
| JESD-30 Code | S-PBGA-B256 | |
| Qualification Status | Not Qualified | |
| JESD-609 Code | e0 | |
| Moisture Sensitivity Level | 3 | |
| Operating Temperature-Max | 85 °C | |
| Peak Reflow Temperature (Cel) | 240 | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Number of Terminals | 256 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA256,16X16,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Surface Mount | YES | |
| Terminal Finish | Tin/Lead (Sn63Pb37) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Width | 17 mm | |
| Length | 17 mm | |
| Seated Height-Max | 2 mm | |
| Ihs Manufacturer | XILINX INC | |
| Part Package Code | BGA | |
| Package Description | FBGA-256 | |
| Pin Count | 256 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| ECCN Code | EAR99 |
XC2S400E-7FT256C Datasheet Download
XC2S400E-7FT256C Overview
The XC2S400E-7FT256C chip model is a cutting-edge technology that is becoming increasingly popular in the tech industry. It is a low-power, high-performance field-programmable gate array (FPGA) chip, designed for a wide range of applications. It is capable of delivering the highest performance, while consuming the least amount of power.
The XC2S400E-7FT256C chip model has a wide range of advantages. It has high data processing speed and is highly scalable. It features advanced power-saving features that can help reduce power consumption. It also has a large number of configurable logic blocks and I/O pins, allowing for a wide range of applications. Furthermore, it is designed to be highly reliable and can withstand harsh environments.
The XC2S400E-7FT256C chip model is expected to have a growing demand in the coming years. It is being increasingly adopted in the Internet of Things (IoT) industry, as it can be used to build powerful and reliable networks. It is also being used in the automotive industry, as it can be used to build reliable and efficient autonomous vehicles. Furthermore, it is being used in the medical industry, as it can be used to build reliable and secure medical systems.
The XC2S400E-7FT256C chip model can be used in various intelligent scenarios. It can be used to build intelligent networks, where it can be used to process large amounts of data and make informed decisions. It can also be used to build intelligent systems, where it can be used to process data efficiently and make decisions quickly. Furthermore, it can be used to build fully intelligent systems, where it can be used to process large amounts of data and make decisions in real-time.
The XC2S400E-7FT256C chip model has a specific design requirement. It needs to be designed to be low-power, high-performance, and highly reliable. It also needs to be designed to be highly scalable and to have a large number of configurable logic blocks and I/O pins. Furthermore, it needs to be designed to be able to withstand harsh environments.
The XC2S400E-7FT256C chip model has been used in a number of case studies. It has been used to build powerful and reliable networks, autonomous vehicles, and medical systems. Furthermore, it has been used to build intelligent networks, intelligent systems, and fully intelligent systems.
When using the XC2S400E-7FT256C chip model, it is important to take certain precautions. It is important to ensure that the chip is designed to be low-power and high-performance. It is also important to ensure that it is designed to be highly reliable and to be able to withstand harsh environments. Furthermore, it is important to ensure that it is designed to be highly scalable and to have a large number of configurable logic blocks and I/O pins.
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